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CSD19505KTTT

Texas Instruments

CSD19505KTTT by Texas Instruments

CSD19505KTTT by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. It has a DS Breakdown Voltage of 80V, IDM of 400A, and EAS of 510mJ. With an operating range from -55 to 175 °C, it features a Drain connection and 0.0038 ohm On Resistance.

Median Price

$3.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,200 parts In-Stock

1+ parts

$1.710

100+ parts

$1.680

1k+ parts

$1.640

10k+ parts

-

1,200

$1.710

$1.680

$1.640

-

Texas Instruments

USA . 5,350 parts In-Stock

1+ parts

$3.200

100+ parts

$2.804

1k+ parts

$1.584

10k+ parts

-

5,350

$3.200

$2.804

$1.584

-

DigiKey

USA . 75 parts In-Stock

1+ parts

$5.860

100+ parts

-

1k+ parts

-

10k+ parts

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75

$5.860

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,091 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

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2,091

$3.040

-

-

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Vyrian

USA . 8,273 parts In-Stock

1+ parts

-

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8,273

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-

-

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Nova Conductors

Japan . 19 parts In-Stock

1+ parts

-

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,057 parts In-Stock

1+ parts

$0.348

100+ parts

-

1k+ parts

-

10k+ parts

-

1,057

$0.348

-

-

-

Parana Technologies

USA . 2,349 parts In-Stock

1+ parts

$0.555

100+ parts

-

1k+ parts

$1.656

10k+ parts

-

2,349

$0.555

-

$1.656

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DigiPath Technology Company

USA . 280 parts In-Stock

1+ parts

$0.612

100+ parts

$0.563

1k+ parts

-

10k+ parts

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280

$0.612

$0.563

-

-

ChromeModa Solutions

Germany . 4,852 parts In-Stock

1+ parts

$0.624

100+ parts

$0.512

1k+ parts

-

10k+ parts

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4,852

$0.624

$0.512

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IDEA Electronic Components Group

UK . 2,183 parts In-Stock

1+ parts

$0.624

100+ parts

-

1k+ parts

$0.562

10k+ parts

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2,183

$0.624

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$0.562

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Ampacity Inc.

Singapore . 2,386 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

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10k+ parts

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2,386

$2.720

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Corphita

USA . 2,964 parts In-Stock

1+ parts

$2.880

100+ parts

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2,964

$2.880

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Argo Parts USA

USA . 2,467 parts In-Stock

1+ parts

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2,467

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Continental Prestige Electronics

USA . 699 parts In-Stock

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699

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Experience the power of the CSD19505KTTT by Texas Instruments, a high-quality N-CHANNEL Power FET that excels in switching applications. Crafted by the industry-leading manufacturer, this transistor offers unmatched reliability and performance. Whether you're in need of efficient power management or precise control, this single configuration transistor delivers exceptional value and benefits. Trust in Texas Instruments to provide cutting-edge technology that meets your needs with ease. Elevate your projects with the CSD19505KTTT - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for switching applications due to their fast switching speeds and high efficiency.

Configuration: SINGLE

The single configuration simplifies circuit design and makes the FET easier to integrate into existing systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers optimized performance in these types of circuits.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and improving overall layout.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage of 80V ensures robust performance and protection against voltage spikes and surges.

Package Shape: RECTANGULAR

The rectangular shape of the package provides efficient use of PCB real estate and allows for easy alignment during assembly.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and reliable connections, minimizing the risk of electrical faults.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and offer fast switching speeds, making them ideal for high-performance applications.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating of 400A allows for handling surges in current, making this FET suitable for demanding applications.

Avalanche Energy Rating (EAS): 510 mJ

The high avalanche energy rating ensures the FET can withstand sudden voltage spikes and transient events without damage.

No. of Terminals: 3

Having 3 terminals simplifies the connection and operation of the FET in a circuit, making installation easier.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for efficient heat dissipation during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high efficiency and reliability, making this FET a good choice for various applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175°C, this FET can withstand elevated temperatures and harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this FET a dependable choice for demanding applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows this FET to operate in cold environments without performance degradation.

Terminal Finish: MATTE TIN

The matte tin finish provides good electrical conductivity and corrosion resistance, ensuring reliable connections over time.

Maximum Drain Current (ID): 200 A

With a maximum drain current of 200A, this FET can handle high current loads with ease, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0038 ohm

The low drain-source on resistance of 0.0038 ohm minimizes power losses and improves efficiency in the FET's operation.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures proper alignment during installation.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this FET is less susceptible to moisture damage during handling and storage.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and improves overall efficiency in power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly and reduces the risk of component damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and reliable soldering of the FET onto the PCB during assembly.

Maximum Feedback Capacitance (Crss): 34 pF

The low feedback capacitance of 34pF minimizes signal distortion and improves overall performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD19505KTTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

510 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

34 pF

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19505KTTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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