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CSD18536KTTT

Texas Instruments

CSD18536KTTT by Texas Instruments

CSD18536KTTT by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. It has a 60V DS Breakdown Voltage, 400A IDM, and 0.0022 ohm Drain-Source On Resistance. With ENHANCEMENT MODE operation and METAL-OXIDE SEMICONDUCTOR technology, it offers high performance in various power management systems.

Median Price

$5.746

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,824 parts In-Stock

1+ parts

$4.571

100+ parts

$4.006

1k+ parts

$2.263

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8,824

$4.571

$4.006

$2.263

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Mouser Electronics

USA . 70 parts In-Stock

1+ parts

$6.920

100+ parts

$3.240

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70

$6.920

$3.240

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DigiKey

USA . 782 parts In-Stock

1+ parts

$7.410

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782

$7.410

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RS (Exports)

UK . 30 parts In-Stock

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$3.709

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30

-

$3.709

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Distributors (In-Stock)

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Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$3.646

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35

$3.646

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Digiode

USA . 3,222 parts In-Stock

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$4.342

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3,222

$4.342

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TME

Poland . 294 parts In-Stock

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$6.470

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$3.460

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294

$6.470

$3.460

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Vyrian

USA . 4,919 parts In-Stock

1+ parts

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4,919

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Chip Stock

USA . 3,030 parts In-Stock

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 424 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

$1.847

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424

$0.936

-

$1.847

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DigiPath Technology Company

USA . 1,315 parts In-Stock

1+ parts

$1.031

100+ parts

$0.948

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1,315

$1.031

$0.948

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ChromeModa Solutions

Germany . 1,439 parts In-Stock

1+ parts

$1.052

100+ parts

$0.863

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1,439

$1.052

$0.863

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

1+ parts

$1.052

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$0.947

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1,158

$1.052

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$0.947

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Ampacity Inc.

Singapore . 2,355 parts In-Stock

1+ parts

$3.150

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$3.150

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Semicontronic

India . 2,184 parts In-Stock

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$3.150

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$3.071

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$3.056

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2,184

$3.150

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Argo Parts USA

USA . 3,345 parts In-Stock

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$3.646

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3,345

$3.646

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Netroflash

USA . 100 parts In-Stock

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$3.646

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$3.573

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100

$3.646

$3.573

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Corohmni

South Africa . 67 parts In-Stock

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$3.919

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67

$3.919

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Corphita

USA . 787 parts In-Stock

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$4.114

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787

$4.114

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$4.230

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$3.891

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$3.646

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15

$4.230

$3.891

$3.646

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Continental Prestige Electronics

USA . 137 parts In-Stock

1+ parts

$4.610

100+ parts

$2.740

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$2.110

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137

$4.610

$2.740

$2.110

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience the reliable performance and quality of Texas Instruments with the CSD18536KTTT Power Field Effect Transistor. This N-CHANNEL transistor is ideal for switching applications, offering a high level of efficiency and durability. With a maximum drain current of 200A and a low on-resistance of 0.0022 ohm, this transistor delivers exceptional performance in a variety of scenarios. Trust Texas Instruments to provide you with the cutting-edge technology and superior components you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel polarity type allows for efficient current flow, making this FET suitable for switching applications.

Configuration: SINGLE

The single configuration simplifies circuit design and installation, making this FET easy to use for different projects.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast and efficient performance, perfect for controlling electric power.

Surface Mount: YES

With surface mount capability, this FET can be easily integrated onto circuit boards, saving space and allowing for compact designs.

Minimum DS Breakdown Voltage: 60 V

The high minimum breakdown voltage ensures reliable operation and protection against voltage spikes, making this FET ideal for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various devices, offering versatility in design options.

Terminal Form: GULL WING

The gull wing terminal form provides a secure connection and ease of soldering, ensuring reliable performance in different environments.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode offers precise control over the FET's conductivity, enhancing its efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 400 A

With a high maximum pulsed drain current, this FET can handle heavy loads and sudden power surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 819 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy pulses, ensuring reliable performance in rugged conditions.

No. of Terminals: 3

With three terminals, this FET provides the necessary connections for efficient power control, making it a versatile component for different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs, making this FET ideal for applications with size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance and efficiency, making this FET a reliable choice for various electronic applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand high heat conditions, ensuring reliable performance in challenging environments.

Transistor Element Material: SILICON

The silicon transistor element material provides stability and durability, making this FET a robust choice for long-term use.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making this FET suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and solderability, ensuring a secure connection and long-term reliability.

Maximum Drain Current (ID): 200 A

With a high maximum drain current, this FET can handle heavy loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0022 ohm

The low maximum drain-source on resistance ensures minimal power loss and efficient operation, making this FET ideal for high-performance circuits.

Terminal Position: SINGLE

The single terminal position simplifies installation and circuit design, making this FET easy to use for various projects.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the FET's resistance to moisture, ensuring reliable performance in damp conditions.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and thermal management, ensuring optimal performance in high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this FET can withstand reflow soldering processes, making it easy to integrate into circuit boards.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the FET can withstand high-temperature soldering processes, ensuring secure connections for reliable performance.

Maximum Feedback Capacitance (Crss): 51 pF

With a low maximum feedback capacitance, this FET offers fast switching speeds and reduced signal distortion, making it ideal for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD18536KTTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

819 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

51 pF

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18536KTTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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