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CSD16321Q5C

Texas Instruments

CSD16321Q5C by Texas Instruments

CSD16321Q5C by Texas Instruments is a N-CHANNEL Power FET with 25V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 200A IDM, 218mJ EAS, and 0.0038 ohm RDS(on). Operating from -55 to 150 °C, this MOSFET has a compact SMALL OUTLINE package with DUAL terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,652 parts In-Stock

1+ parts

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3,652

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Digiode

USA . 2,705 parts In-Stock

1+ parts

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100+ parts

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2,705

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,332 parts In-Stock

1+ parts

$0.967

100+ parts

-

1k+ parts

$1.866

10k+ parts

-

1,332

$0.967

-

$1.866

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DigiPath Technology Company

USA . 1,611 parts In-Stock

1+ parts

$1.065

100+ parts

$0.980

1k+ parts

-

10k+ parts

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1,611

$1.065

$0.980

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ChromeModa Solutions

Germany . 5,447 parts In-Stock

1+ parts

$1.087

100+ parts

$0.891

1k+ parts

-

10k+ parts

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5,447

$1.087

$0.891

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IDEA Electronic Components Group

UK . 2,325 parts In-Stock

1+ parts

$1.087

100+ parts

-

1k+ parts

$0.978

10k+ parts

-

2,325

$1.087

-

$0.978

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Ampacity Inc.

Singapore . 331 parts In-Stock

1+ parts

$3.050

100+ parts

-

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331

$3.050

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AZTECH Wire

Italy . 761 parts In-Stock

1+ parts

$6.148

100+ parts

-

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761

$6.148

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One Stop Electronics

USA . 758 parts In-Stock

1+ parts

$35.050

100+ parts

-

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758

$35.050

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Semicontronic

India . 1,384 parts In-Stock

1+ parts

$55.050

100+ parts

$53.674

1k+ parts

$53.398

10k+ parts

-

1,384

$55.050

$53.674

$53.398

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Computer Components Inc. - USA

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,613 parts In-Stock

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2,613

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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2,250

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Northwest PG Solutions

USA . 2,003 parts In-Stock

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$4.246

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2,003

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$4.246

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Assy Fe

Spain . 1,428 parts In-Stock

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1,428

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Native Components

USA . 324 parts In-Stock

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$4.203

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324

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$4.203

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Corohmni

South Africa . 161 parts In-Stock

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161

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GreenTree Electronics

Israel . 82 parts In-Stock

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82

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Speed Components Ltd (Excess)

Israel . 82 parts In-Stock

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82

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Overview

Elevate your power management solutions with the CSD16321Q5C by Texas Instruments. Designed with precision and reliability, this N-CHANNEL Power FET boasts a single configuration with a built-in diode, ideal for switching applications. With a high maximum drain current of 100A and low on-resistance of 0.0038 ohm, this transistor offers exceptional performance in a compact small outline package. Trust Texas Instruments' expertise in semiconductor technology to deliver top-notch quality and efficiency, ensuring optimal power distribution in various electronic devices. Experience seamless operation and enhanced functionality with the CSD16321Q5C, setting new standards for power transistors in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are efficient for high-side and low-side switching applications, making this product versatile for different circuit configurations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies design and provides reverse polarity protection, making the product convenient and reliable for users.

Transistor Application: SWITCHING

Designed for switching applications, this FET is optimized for fast switching speeds and high efficiency, making it suitable for power management in various systems.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost for manufacturers.

Maximum Drain Current (ID): 100 A

With a high maximum drain current rating, this product can handle heavy loads and power requirements, suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures stable performance in harsh environments, making this FET suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD16321Q5C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

218 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD16321Q5C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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