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COP840C-XXX/WM

Texas Instruments

COP840C-XXX/WM by Texas Instruments

The Texas Instruments COP840C-XXX/WM microcontroller features 8-bit size, 2048 ROM words, and 128 RAM bytes. With a package style of small outline, it is ideal for industrial applications requiring PWM channels and SCI connectivity. Operating b/w -40 to 85 °C, this CMOS technology device offers versatile performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,072 parts In-Stock

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Digiode

USA . 2,026 parts In-Stock

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Anansix

USA . 1,922 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 270 parts In-Stock

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$12.000

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270

$12.000

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AZTECH Wire

Italy . 346 parts In-Stock

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$18.487

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346

$18.487

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Native Components

USA . 804 parts In-Stock

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$39.982

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$38.383

804

$39.982

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$38.383

Northwest PG Solutions

USA . 220 parts In-Stock

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$43.981

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220

$43.981

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Parana Technologies

USA . 143 parts In-Stock

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$62.378

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143

$62.378

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DigiPath Technology Company

USA . 171 parts In-Stock

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$68.686

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IDEA Electronic Components Group

UK . 1,268 parts In-Stock

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$70.088

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$66.584

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$63.079

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1,268

$70.088

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$63.079

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ChromeModa Solutions

Germany . 961 parts In-Stock

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$70.088

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$57.472

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961

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Corphita

USA . 477 parts In-Stock

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477

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Overview

Discover the innovative COP840C-XXX/WM microcontroller by Texas Instruments, a leading manufacturer known for its top-quality products. Ideal for a wide range of applications, this small outline device offers customers unparalleled value and benefits. With 8-bit size, 2048 ROM words, 128 RAM bytes, and peripherals like TIMER and SCI connectivity, this industrial-grade microcontroller provides optimal performance in a compact package. Trust Texas Instruments for reliability, efficiency, and cutting-edge technology with the COP840C-XXX/WM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy installation on circuit boards, increasing efficiency in production processes.

Maximum Supply Voltage: 6 V

Can handle higher voltage inputs, offering flexibility in power supply options.

Bit Size: 8

Provides sufficient processing capabilities for basic to intermediate tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, increasing energy efficiency and stability.

Technical Specifications

Microcontrollers COP840C-XXX/WM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

10 rpm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI

Peripherals:

TIMER

Trade Compliance

COP840C-XXX/WM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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