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COP822C-XXX/WM

Texas Instruments

COP822C-XXX/WM by Texas Instruments

COP822C-XXX/WM by Texas Instruments is an 8-bit microcontroller with 1024 ROM words and 64 RAM bytes. It operates in industrial temperature range (-40 to 85 °C) and offers peripherals like TIMER, PWM channels, and SCI connectivity. Ideal for applications requiring small outline package style, dual terminal position, and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,884 parts In-Stock

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Digiode

USA . 2,502 parts In-Stock

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2,502

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Anansix

USA . 1,073 parts In-Stock

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1,073

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Distributors (Availability)

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Native Components

USA . 568 parts In-Stock

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$0.134

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-

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$0.129

568

$0.134

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$0.129

Northwest PG Solutions

USA . 1,743 parts In-Stock

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$0.147

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$0.130

1,743

$0.147

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$0.130

AZTECH Wire

Italy . 848 parts In-Stock

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$18.392

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848

$18.392

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One Stop Electronics

USA . 1,398 parts In-Stock

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$19.000

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1,398

$19.000

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Parana Technologies

USA . 682 parts In-Stock

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$28.722

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$51.012

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682

$28.722

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$51.012

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DigiPath Technology Company

USA . 1,674 parts In-Stock

1+ parts

$31.627

100+ parts

$29.096

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$31.627

$29.096

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ChromeModa Solutions

Germany . 4,778 parts In-Stock

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$32.272

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$26.463

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$32.272

$26.463

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IDEA Electronic Components Group

UK . 657 parts In-Stock

1+ parts

$32.272

100+ parts

$30.658

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$29.045

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657

$32.272

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$29.045

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Corphita

USA . 4,688 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments COP822C-XXX/WM microcontroller. As a leader in the industry, Texas Instruments guarantees top-quality products that meet the highest standards. This versatile microcontroller is perfect for a wide range of applications, offering exceptional value and performance. With its advanced technology and reliable design, the COP822C-XXX/WM provides customers with unparalleled benefits and advantages, making it the ideal choice for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 6 V

Ability to handle higher voltage levels for versatile applications.

Package Shape: RECTANGULAR

Standard shape for easy integration into electronic systems.

Bit Size: 8

Suitable for handling basic to moderate complexity tasks efficiently.

No. of Terminals: 20

Provides sufficient connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact design for space-constrained applications.

Minimum Supply Voltage: 2.5 V

Operates efficiently even at low voltage levels, conserving power.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions.

Terminal Position: DUAL

Enhanced connectivity options for versatile circuit designs.

ROM Words: 1024

Sufficient memory capacity for storing program instructions.

Maximum Seated Height: 2.642 mm

Low profile design for compact electronic assemblies.

Width: 7.493 mm

Compact size for fitting into small electronic devices.

Peripherals: TIMER

Integrated timer for precise timekeeping and scheduling tasks.

Length: 12.8 mm

Optimal length for accommodating necessary components on a PCB.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for embedded control applications, offering versatile functionality.

RAM Bytes: 64

Sufficient random-access memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: GULL WING

Enhanced durability and reliability of terminal connections.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of analog signals.

Connectivity: SCI

Serial Communication Interface for data exchange with external devices.

ROM Programmability: MROM

Mask ROM for secure and permanent program storage.

Terminal Pitch: 1.27 mm

Standard spacing for easy soldering and assembly.

Speed: 10 rpm

Operates efficiently at a moderate speed for various applications.

On Chip Program ROM Width: 8

Efficient program storage directly on the microcontroller chip.

No. of I/O Lines: 16

Sufficient Input/Output lines for interfacing with external components.

Technical Specifications

Microcontrollers COP822C-XXX/WM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

MROM

Maximum Seated Height:

2.642 mm

Speed:

10 rpm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.493 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI

Peripherals:

TIMER

Trade Compliance

COP822C-XXX/WM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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