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COP822C-XXX/N

Texas Instruments

COP822C-XXX/N by Texas Instruments

The Texas Instruments COP822C-XXX/N is an 8-bit microcontroller with 1024 ROM words and 64 RAM bytes. It operates b/w -40 to 85 °C, has a supply voltage range of 2.5V to 6V, and features peripherals like TIMER and SCI connectivity. Ideal for industrial applications requiring precise timing and communication capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,464 parts In-Stock

1+ parts

-

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4,464

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Digiode

USA . 2,320 parts In-Stock

1+ parts

-

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2,320

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Anansix

USA . 344 parts In-Stock

1+ parts

-

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344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 745 parts In-Stock

1+ parts

$0.067

100+ parts

-

1k+ parts

-

10k+ parts

$0.064

745

$0.067

-

-

$0.064

Northwest PG Solutions

USA . 447 parts In-Stock

1+ parts

$0.074

100+ parts

-

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-

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$0.065

447

$0.074

-

-

$0.065

AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$12.465

100+ parts

-

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817

$12.465

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One Stop Electronics

USA . 771 parts In-Stock

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$30.000

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-

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771

$30.000

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Parana Technologies

USA . 1,646 parts In-Stock

1+ parts

$50.661

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1,646

$50.661

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ChromeModa Solutions

Germany . 527 parts In-Stock

1+ parts

$56.922

100+ parts

$46.676

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527

$56.922

$46.676

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IDEA Electronic Components Group

UK . 135 parts In-Stock

1+ parts

$56.922

100+ parts

$54.076

1k+ parts

$51.230

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135

$56.922

$54.076

$51.230

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Corphita

USA . 4,763 parts In-Stock

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4,763

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DigiPath Technology Company

USA . 1,449 parts In-Stock

1+ parts

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100+ parts

$51.321

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1,449

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$51.321

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Overview

Unlock endless possibilities with the Texas Instruments COP822C-XXX/N Microcontroller. Crafted with precision and quality, this device offers unparalleled performance in a wide range of applications. Whether you're designing IoT devices, smart home appliances, or industrial control systems, this microcontroller delivers seamless connectivity and efficient operation. With its advanced technology and reliable design, the COP822C-XXX/N ensures that your projects run smoothly and efficiently. Elevate your creations with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability in various operating environments.

Maximum Supply Voltage: 6 V

Allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Bit Size: 8

8-bit architecture offers a good balance between performance and cost, suitable for many embedded applications.

ROM Words: 1024

Ample read-only memory capacity for storing program instructions, allowing for complex functionalities to be implemented.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller efficient and reliable in operation.

Peripherals: TIMER

Built-in timer peripheral enables accurate time tracking and synchronization in various applications.

Connectivity: SCI

Supports serial communication interface for connecting to other devices, facilitating data exchange and interaction.

RAM Bytes: 64

Sufficient random access memory for data storage and manipulation, enabling efficient processing of real-time tasks.

Technical Specifications

Microcontrollers COP822C-XXX/N attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

Length:

26.075 mm

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

RAM Bytes:

64

ROM Words:

1024

ROM Programmability:

MROM

Maximum Seated Height:

5.08 mm

Speed:

10 rpm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI

Peripherals:

TIMER

Trade Compliance

COP822C-XXX/N Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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