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COP87L88CFV-XE

Texas Instruments

COP87L88CFV-XE by Texas Instruments

COP87L88CFV-XE by Texas Instruments is an 8-bit microcontroller with 44 terminals, operating at up to 10 MHz. Suitable for industrial applications, it features OTPROM ROM programmability and ADC channels. With a temperature range of -40 to 85°C, this CMOS technology chip carrier has a square shape and J bend terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,376 parts In-Stock

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EMSNET

USA . 2,575 parts In-Stock

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Digiode

USA . 1,804 parts In-Stock

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Anansix

USA . 1,187 parts In-Stock

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Native Components

USA . 314 parts In-Stock

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$6.175

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314

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AZTECH Wire

Italy . 236 parts In-Stock

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$9.899

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One Stop Electronics

USA . 1,312 parts In-Stock

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$17.000

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Parana Technologies

USA . 131 parts In-Stock

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$64.367

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ChromeModa Solutions

Germany . 5,607 parts In-Stock

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$72.322

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$59.304

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IDEA Electronic Components Group

UK . 2,253 parts In-Stock

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$72.322

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$68.706

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$65.090

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Corphita

USA . 2,763 parts In-Stock

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DigiPath Technology Company

USA . 2,111 parts In-Stock

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$65.206

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Northwest PG Solutions

USA . 1,097 parts In-Stock

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Overview

Looking for a reliable and high-quality microcontroller for your next project? Look no further than the COP87L88CFV-XE by Texas Instruments. With a reputable manufacturer like Texas Instruments, you can trust that this microcontroller will exceed your expectations. Ideal for a wide range of applications, this microcontroller offers incredible value with its versatile features and benefits. Don't compromise on quality or performance - choose the COP87L88CFV-XE for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides electrical insulation and protection for the internal components, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Easy to mount on printed circuit boards, saving space and allowing for automated assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, making it versatile for different applications.

Bit Size: 8

Suitable for handling basic tasks and applications that do not require high computational power.

No. of Terminals: 44

Offers ample connection points for interfacing with external devices and peripherals.

Maximum Clock Frequency: 10 MHz

Provides fast processing speed for executing instructions and tasks efficiently.

ROM Programmability: OTPROM

Allows for one-time programmability of read-only memory, ensuring data retention without the need for constant power supply.

Technical Specifications

Microcontrollers COP87L88CFV-XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

Length:

16.51 mm

No. of I/O Lines:

38

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

COP87L88CFV-XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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