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COP87L88EBV-XE

Texas Instruments

COP87L88EBV-XE by Texas Instruments

COP87L88EBV-XE by Texas Instruments is an 8-bit microcontroller with 16384 ROM words and 192 RAM bytes. It operates at a max clock frequency of 10 MHz, suitable for industrial applications requiring CAN, SPI, UART connectivity. With ADC channels and PWM capabilities, it offers versatile control options in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,348 parts In-Stock

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4,348

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Digiode

USA . 3,018 parts In-Stock

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3,018

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Anansix

USA . 2,692 parts In-Stock

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2,692

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Distributors (Availability)

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Native Components

USA . 261 parts In-Stock

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$12.196

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261

$12.196

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Northwest PG Solutions

USA . 1,143 parts In-Stock

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$13.416

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$12.075

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1,143

$13.416

$12.075

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AZTECH Wire

Italy . 435 parts In-Stock

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$16.087

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435

$16.087

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Parana Technologies

USA . 1,385 parts In-Stock

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$24.958

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$25.658

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1,385

$24.958

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$25.658

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One Stop Electronics

USA . 1,529 parts In-Stock

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$26.000

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1,529

$26.000

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ChromeModa Solutions

Germany . 1,221 parts In-Stock

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$28.043

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$22.995

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$28.043

$22.995

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IDEA Electronic Components Group

UK . 1,073 parts In-Stock

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$28.043

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$26.641

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$25.239

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1,073

$28.043

$26.641

$25.239

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Corphita

USA . 2,002 parts In-Stock

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2,002

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DigiPath Technology Company

USA . 1,945 parts In-Stock

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$25.284

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1,945

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$25.284

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Overview

Unlock endless possibilities with the Texas Instruments COP87L88EBV-XE microcontroller. Crafted with precision and expertise by a renowned manufacturer, this powerful chip offers unrivaled performance and versatility for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value with its high-quality features and advanced capabilities. Experience seamless connectivity, efficient operation, and reliable performance with the COP87L88EBV-XE - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring long-term reliability.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power input options, accommodating a wider range of applications.

ADC Channels: YES

Having Analog to Digital Converters enables the microcontroller to interface with analog sensors or signals, expanding its functionality.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of program instructions, facilitating complex algorithms and operations.

Peripheral IC Type: MICROCONTROLLER

Being specifically designed as a microcontroller ensures optimized performance and compatibility for embedded system applications.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies power requirements and makes it compatible with a wide range of existing systems and components.

Connectivity: CAN, MICROWIRE/PLUS, SPI, UART, USART

Versatile connectivity options allow the microcontroller to communicate with various devices and networks, enhancing its versatility.

Technical Specifications

Microcontrollers COP87L88EBV-XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

Length:

16.51 mm

No. of I/O Lines:

35

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

RAM Bytes:

192

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.51 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, MICROWIRE/PLUS, SPI, UART, USART

Peripherals:

POR, PWM, TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 8-Bit

Trade Compliance

COP87L88EBV-XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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