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COP8SBR9IMT8

Texas Instruments

COP8SBR9IMT8 by Texas Instruments

COP8SBR9IMT8 by Texas Instruments is an 8-bit microcontroller with a max clock frequency of 10 MHz. It features 40 I/O lines, PWM channels, and ROM programmability for various industrial applications. With a small outline package style and dual terminal position, it operates in temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,873 parts In-Stock

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Vyrian

USA . 3,465 parts In-Stock

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Anansix

USA . 1,431 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 630 parts In-Stock

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$9.085

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630

$9.085

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Parana Technologies

USA . 580 parts In-Stock

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$16.334

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$16.638

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580

$16.334

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DigiPath Technology Company

USA . 965 parts In-Stock

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$17.986

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$16.547

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965

$17.986

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IDEA Electronic Components Group

UK . 1,805 parts In-Stock

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$18.353

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$17.435

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$16.518

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$18.353

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ChromeModa Solutions

Germany . 1,126 parts In-Stock

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$18.353

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$15.049

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Ampacity Inc.

Singapore . 281 parts In-Stock

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$21.000

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281

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Semicontronic

India . 993 parts In-Stock

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$31.000

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$30.225

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$30.070

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993

$31.000

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One Stop Electronics

USA . 853 parts In-Stock

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$35.000

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Microchip USA

USA . 4,961 parts In-Stock

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Continental Prestige Electronics

USA . 4,712 parts In-Stock

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Corphita

USA . 3,493 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,152 parts In-Stock

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Argo Parts USA

USA . 1,702 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Unleash the power of innovation with the COP8SBR9IMT8 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. With its advanced technology and versatile features, this microcontroller delivers exceptional performance and efficiency, making it the perfect choice for your next project. Experience the value and benefits that this product brings to your designs, unlocking endless possibilities and driving success in your endeavors. Choose the COP8SBR9IMT8 and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows the microcontroller to handle a wide range of power sources, providing flexibility in design and compatibility with different systems.

Bit Size: 8

The 8-bit size allows for efficient processing capabilities, making the microcontroller suitable for tasks that require moderate complexity and performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can operate effectively in harsh and demanding conditions without sacrificing performance.

ROM Programmability: FLASH

Flash ROM programmability enables easy and convenient reprogramming of the microcontroller, allowing for flexibility in design changes and updates.

Technical Specifications

Microcontrollers COP8SBR9IMT8 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

No. of I/O Lines:

40

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

2 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

COP8SBR9IMT8 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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