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COP87L84BCM-XE

Texas Instruments

COP87L84BCM-XE by Texas Instruments

COP87L84BCM-XE by Texas Instruments is an 8-bit microcontroller with a clock frequency of 10 MHz, suitable for industrial applications. It operates b/w -40 to 85 °C and has 18 I/O lines, making it ideal for PWM control. With OTPROM ROM programmability and a supply voltage range of 4.5V to 5.5V, this CMOS technology-based microcontroller offers versatile performance in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,155 parts In-Stock

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Digiode

USA . 2,557 parts In-Stock

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Anansix

USA . 1,551 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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AZTECH Wire

Italy . 521 parts In-Stock

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$11.585

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521

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One Stop Electronics

USA . 1,564 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 506 parts In-Stock

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$29.000

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Parana Technologies

USA . 1,213 parts In-Stock

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$43.772

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DigiPath Technology Company

USA . 650 parts In-Stock

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$48.198

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ChromeModa Solutions

Germany . 1,476 parts In-Stock

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$49.182

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$40.329

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$49.182

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$46.723

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$44.264

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141

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Argo Parts USA

USA . 2,891 parts In-Stock

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Corphita

USA . 2,543 parts In-Stock

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Continental Prestige Electronics

USA . 1,347 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Upgrade your projects with the COP87L84BCM-XE microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This microcontroller offers endless possibilities in various applications, ensuring smooth operation and optimal performance. With its advanced features and innovative design, the COP87L84BCM-XE provides unmatched value and benefits to customers looking to elevate their electronic designs. Experience the difference today and unlock the full potential of your projects with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the microcontroller lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability simplifies the manufacturing process and allows for compact PCB designs.

Maximum Supply Voltage: 5.5 V

Supports a high maximum supply voltage, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and easy to integrate into circuit layouts.

Bit Size: 8

8-bit architecture allows for cost-effective solutions in applications with lower processing requirements.

No. of Terminals: 28

A higher number of terminals offers more connectivity options for interfacing with external components.

Maximum Clock Frequency: 10 MHz

Capable of operating at a high clock frequency, enabling fast processing speeds for time-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh environmental conditions.

ROM Programmability: OTPROM

One-Time Programmable ROM allows for permanent storage of firmware or configuration data, ideal for secure applications.

No. of I/O Lines: 18

A higher number of I/O lines offer more flexibility for interfacing with external peripherals and sensors.

Technical Specifications

Microcontrollers COP87L84BCM-XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of I/O Lines:

18

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

COP87L84BCM-XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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