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COP87L84RGM-XE

Texas Instruments

COP87L84RGM-XE by Texas Instruments

COP87L84RGM-XE by Texas Instruments is an 8-bit microcontroller with 32768 ROM words, 256 RAM bytes, and peripherals like comparator, PWM, and UART. It operates in industrial temperature range (-40 to 85 °C) with a max clock frequency of 10 MHz. Ideal for applications requiring small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,448 parts In-Stock

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Vyrian

USA . 2,381 parts In-Stock

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Anansix

USA . 1,773 parts In-Stock

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Native Components

USA . 144 parts In-Stock

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$5.670

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One Stop Electronics

USA . 1,282 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 897 parts In-Stock

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$11.137

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Parana Technologies

USA . 1,947 parts In-Stock

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$63.997

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IDEA Electronic Components Group

UK . 1,529 parts In-Stock

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$71.907

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$68.312

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$64.716

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ChromeModa Solutions

Germany . 183 parts In-Stock

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$71.907

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$58.964

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Corphita

USA . 4,162 parts In-Stock

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Northwest PG Solutions

USA . 984 parts In-Stock

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DigiPath Technology Company

USA . 627 parts In-Stock

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$64.831

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Kepictronics

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Overview

Unlock the power of innovation with the Texas Instruments COP87L84RGM-XE microcontroller. Crafted with precision and expertise by a trusted manufacturer, this versatile device offers endless possibilities for your projects. Whether you're working on robotics, automation, or electronics, the COP87L84RGM-XE delivers unmatched performance and reliability. Seamlessly integrate peripherals like comparators, PWM, timers, and more to bring your designs to life. Experience the ease and efficiency of this cutting-edge technology, designed to elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring product longevity and affordability.

Surface Mount: YES

Easy to mount on circuit boards, saving time and effort in the assembly process.

Maximum Supply Voltage: 5.5 V

Capable of handling higher voltage inputs, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Standard shape for easy integration into various electronic devices and circuits.

Bit Size: 8

Ideal for handling basic tasks and applications efficiently.

No. of Terminals: 28

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving and efficient PCB layout.

Minimum Supply Voltage: 2.7 V

Ability to operate at low voltages, saving power and extending battery life.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal position for enhanced connectivity and reliability.

ROM Words: 32768

Sufficient memory for storing program instructions and data.

Maximum Seated Height: 2.65 mm

Low-profile design for space-constrained applications.

Width: 7.5 mm

Compact width for integration into small electronic devices.

Peripherals: COMPARATOR, PWM, TIMER(4), WDT

Includes essential peripherals for diverse functionality and application support.

Maximum Clock Frequency: 10 MHz

Capable of high-speed processing for quick response times.

Length: 17.9 mm

Optimal length for fitting into various electronic enclosures.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with reliability and durability.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring compatibility and performance.

RAM Bytes: 256

Adequate RAM for temporary data storage during operation.

Technology: CMOS

Low-power technology for energy-efficient operation and extended battery life.

Terminal Form: GULL WING

Gull-wing terminals for secure solder connections and reliable electrical connections.

Nominal Supply Voltage: 4.5 V

Stable supply voltage for consistent and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels for precise control of connected devices or peripherals.

Connectivity: MICROWIRE/PLUS, UART

Supports multiple communication protocols for enhanced connectivity options.

ROM Programmability: OTPROM

One-Time Programmable ROM for secure and permanent storage of program data.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and designs.

On Chip Program ROM Width: 8

Optimal ROM width for efficient program execution and storage.

No. of I/O Lines: 24

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers COP87L84RGM-XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

RAM Bytes:

256

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

MICROWIRE/PLUS, UART

Peripherals:

COMPARATOR, PWM, TIMER(4), WDT

Trade Compliance

COP87L84RGM-XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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