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COP87L84RGN-XE

Texas Instruments

COP87L84RGN-XE by Texas Instruments

COP87L84RGN-XE by Texas Instruments is an 8-bit microcontroller with 32768 ROM words, 256 RAM bytes, and a max clock frequency of 10 MHz. It features peripherals like comparator, PWM, timer(4), WDT and connectivity options including MICROWIRE/PLUS and UART. Ideal for industrial applications requiring a reliable microcontroller with versatile functionalities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,709 parts In-Stock

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7,709

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Digiode

USA . 4,609 parts In-Stock

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4,609

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Anansix

USA . 1,080 parts In-Stock

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1,080

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Distributors (Availability)

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Native Components

USA . 793 parts In-Stock

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$9.561

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793

$9.561

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Northwest PG Solutions

USA . 1,782 parts In-Stock

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$10.517

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$9.465

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$10.517

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AZTECH Wire

Italy . 742 parts In-Stock

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$14.271

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742

$14.271

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One Stop Electronics

USA . 1,218 parts In-Stock

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$33.000

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$33.000

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Parana Technologies

USA . 312 parts In-Stock

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$74.125

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312

$74.125

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ChromeModa Solutions

Germany . 5,652 parts In-Stock

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$83.287

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$68.295

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$83.287

$68.295

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IDEA Electronic Components Group

UK . 819 parts In-Stock

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$83.287

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$79.123

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$74.958

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819

$83.287

$79.123

$74.958

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Corphita

USA . 3,284 parts In-Stock

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DigiPath Technology Company

USA . 1,849 parts In-Stock

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$75.092

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Overview

Discover the cutting-edge technology of the COP87L84RGN-XE microcontroller by Texas Instruments, designed to provide exceptional performance and reliability for a wide range of applications. With its high-quality construction and advanced features such as comparator, PWM, and UART connectivity, this versatile device offers unmatched value and benefits to customers looking for precision and efficiency in their projects. Whether you're working on industrial automation, consumer electronics, or automotive systems, the COP87L84RGN-XE delivers the power and innovation you need to bring your ideas to life. Elevate your designs with Texas Instruments' industry-leading microcontrollers today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a long lifespan.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources.

Bit Size: 8

Suitable for handling basic tasks and applications efficiently.

ROM Words: 32768

Offers ample storage space for program instructions and data.

Peripherals: COMPARATOR, PWM, TIMER(4), WDT

Includes various peripherals for added functionality and versatility.

Maximum Clock Frequency: 10 MHz

Provides fast processing speed for quick execution of tasks.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperatures.

RAM Bytes: 256

Sufficient memory for temporary storage of data during operation.

Technology: CMOS

Low power consumption and high noise immunity for efficient performance.

Connectivity: MICROWIRE/PLUS, UART

Supports communication with other devices and systems, enhancing connectivity options.

Technical Specifications

Microcontrollers COP87L84RGN-XE attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T28

Length:

35.725 mm

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

RAM Bytes:

256

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

5.334 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

MICROWIRE/PLUS, UART

Peripherals:

COMPARATOR, PWM, TIMER(4), WDT

Trade Compliance

COP87L84RGN-XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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