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CDCFR83DBQG4

Texas Instruments

CDCFR83DBQG4 by Texas Instruments

The Texas Instruments CDCFR83DBQG4 clock driver features 24 terminals, operates at -40 to 85°C, with a supply voltage range of 3.135V to 3.465V. It offers a max frequency of 533MHz and is suitable for industrial applications requiring precise timing synchronization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,757 parts In-Stock

1+ parts

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8,757

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Digiode

USA . 4,831 parts In-Stock

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4,831

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 595 parts In-Stock

1+ parts

$1.023

100+ parts

-

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595

$1.023

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Northwest PG Solutions

USA . 1,599 parts In-Stock

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$1.126

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1,599

$1.126

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Andel Nordic

Denmark . 3,044 parts In-Stock

1+ parts

$3.857

100+ parts

-

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$3.702

10k+ parts

$3.702

3,044

$3.857

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$3.702

$3.702

Parana Technologies

USA . 2,329 parts In-Stock

1+ parts

$12.407

100+ parts

-

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$12.844

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2,329

$12.407

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$12.844

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ChromeModa Solutions

Germany . 3,313 parts In-Stock

1+ parts

$13.941

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$11.432

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3,313

$13.941

$11.432

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IDEA Electronic Components Group

UK . 881 parts In-Stock

1+ parts

$13.941

100+ parts

$13.244

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$12.547

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881

$13.941

$13.244

$12.547

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AZTECH Wire

Italy . 597 parts In-Stock

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$15.550

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597

$15.550

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One Stop Electronics

USA . 1,319 parts In-Stock

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$26.000

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1,319

$26.000

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DigiPath Technology Company

USA . 1,994 parts In-Stock

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$12.569

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1,994

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$12.569

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Corphita

USA . 1,501 parts In-Stock

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Kepictronics

USA . 895 parts In-Stock

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895

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Microchip USA

USA . 481 parts In-Stock

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481

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Overview

Elevate your clock driver and buffer game with the CDCFR83DBQG4 by Texas Instruments. Crafted with precision and quality, this product from a trusted manufacturer offers unparalleled performance in clock synchronization and signal buffering. Ideal for a wide range of applications, this small outline, shrink pitch package is designed to meet industrial-grade standards. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this versatile device ensures reliable and efficient operation. Upgrade your electronics with the CDCFR83DBQG4 and experience the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Facilitates easy and convenient installation on the circuit board, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standardized voltage level, ensuring compatibility with other components in the system.

Maximum Operating Temperature: 85 °C

Allows the clock driver to function reliably in a wide range of environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ensures the clock driver can withstand low temperatures without compromising performance, ideal for harsh operating environments.

Width: 3.9 mm

Compact size enables space-saving design and integration into tight spaces within the electronic system.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making it energy-efficient and reliable.

Technical Specifications

Clock Drivers & Buffers CDCFR83DBQG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

83

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

1

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

533 MHz

Trade Compliance

CDCFR83DBQG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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