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CDCF5801ADBQ

Texas Instruments

CDCF5801ADBQ by Texas Instruments

Texas Instruments CDCF5801ADBQ clock driver features 24 terminals, operates at -40 to 85°C, with a max supply voltage of 3.6V. Ideal for industrial applications, it offers a max frequency of 280MHz and supports surface mount technology in a small outline package.

Median Price

$5.732

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,878 parts In-Stock

1+ parts

$5.732

100+ parts

$4.673

1k+ parts

$3.115

10k+ parts

-

20,878

$5.732

$4.673

$3.115

-

Mouser Electronics

USA . 140 parts In-Stock

1+ parts

$9.940

100+ parts

$6.430

1k+ parts

$4.860

10k+ parts

-

140

$9.940

$6.430

$4.860

-

Rochester

USA . 1,126 parts In-Stock

1+ parts

-

100+ parts

$4.470

1k+ parts

$4.000

10k+ parts

$3.770

1,126

-

$4.470

$4.000

$3.770

Verical

USA . 592 parts In-Stock

1+ parts

-

100+ parts

$5.588

1k+ parts

$5.000

10k+ parts

$4.713

592

-

$5.588

$5.000

$4.713

DigiKey

USA . 192 parts In-Stock

1+ parts

-

100+ parts

$5.890

1k+ parts

-

10k+ parts

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192

-

$5.890

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,391 parts In-Stock

1+ parts

$4.114

100+ parts

-

1k+ parts

-

10k+ parts

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3,391

$4.114

-

-

-

Vyrian

USA . 8,257 parts In-Stock

1+ parts

-

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8,257

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-

-

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DigiKey Marketplace

USA . 192 parts In-Stock

1+ parts

-

100+ parts

-

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192

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 81 parts In-Stock

1+ parts

$1.585

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$1.585

-

-

-

Northwest PG Solutions

USA . 899 parts In-Stock

1+ parts

$1.744

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$1.744

-

-

-

Corphita

USA . 4,186 parts In-Stock

1+ parts

$3.897

100+ parts

-

1k+ parts

-

10k+ parts

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4,186

$3.897

-

-

-

Andel Nordic

Denmark . 2,741 parts In-Stock

1+ parts

$10.013

100+ parts

-

1k+ parts

$9.612

10k+ parts

$9.612

2,741

$10.013

-

$9.612

$9.612

Parana Technologies

USA . 803 parts In-Stock

1+ parts

$10.977

100+ parts

-

1k+ parts

$11.438

10k+ parts

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803

$10.977

-

$11.438

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DigiPath Technology Company

USA . 262 parts In-Stock

1+ parts

$12.087

100+ parts

-

1k+ parts

-

10k+ parts

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262

$12.087

-

-

-

ChromeModa Solutions

Germany . 3,556 parts In-Stock

1+ parts

$12.334

100+ parts

$10.114

1k+ parts

-

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3,556

$12.334

$10.114

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-

IDEA Electronic Components Group

UK . 257 parts In-Stock

1+ parts

$12.334

100+ parts

$11.717

1k+ parts

$11.101

10k+ parts

-

257

$12.334

$11.717

$11.101

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$15.193

100+ parts

$13.826

1k+ parts

$12.458

10k+ parts

-

3,000

$15.193

$13.826

$12.458

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Microchip USA

USA . 2,599 parts In-Stock

1+ parts

$21.392

100+ parts

-

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10k+ parts

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2,599

$21.392

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-

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Perfect Parts

USA . 2,658 parts In-Stock

1+ parts

-

100+ parts

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2,658

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-

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your electronic projects with the CDCF5801ADBQ clock driver and buffer by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the Clock Drivers & Buffers category. This versatile component offers precise timing control, ensuring optimal performance in a wide range of applications. With a compact design and advanced features, the CDCF5801ADBQ provides customers with exceptional value, efficiency, and flexibility. Elevate your designs with this high-quality product from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring longevity and reliability.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard power supplies, making it easy to integrate into various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a concern.

Output Characteristics: 3-STATE

Allows for tri-state output, providing flexibility in controlling the signal flow.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed performance.

Technical Specifications

Clock Drivers & Buffers CDCF5801ADBQ attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

DIFFERENTIAL/SINGLE-ENDED OUTPUT AVAILABLE

Family:

5801

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

40 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

280 MHz

Trade Compliance

CDCF5801ADBQ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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