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CDCF2509PWG4

Texas Instruments

CDCF2509PWG4 by Texas Instruments

CDCF2509PWG4 clock driver by Texas Instruments operates at 3.3V, with 24 terminals and a max I (ol) of 12A. It features a small outline package style and is ideal for applications requiring a max fmax of 140MHz, such as commercial-grade temperature-sensitive devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,257 parts In-Stock

1+ parts

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4,257

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Digiode

USA . 795 parts In-Stock

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795

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 582 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

$0.394

582

$0.410

-

-

$0.394

Northwest PG Solutions

USA . 1,156 parts In-Stock

1+ parts

$0.451

100+ parts

-

1k+ parts

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10k+ parts

$0.398

1,156

$0.451

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-

$0.398

Parana Technologies

USA . 555 parts In-Stock

1+ parts

$7.781

100+ parts

-

1k+ parts

$8.326

10k+ parts

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555

$7.781

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$8.326

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DigiPath Technology Company

USA . 1,550 parts In-Stock

1+ parts

$8.568

100+ parts

$7.883

1k+ parts

-

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1,550

$8.568

$7.883

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ChromeModa Solutions

Germany . 5,695 parts In-Stock

1+ parts

$8.743

100+ parts

$7.169

1k+ parts

-

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5,695

$8.743

$7.169

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IDEA Electronic Components Group

UK . 2,050 parts In-Stock

1+ parts

$8.743

100+ parts

$8.306

1k+ parts

$7.869

10k+ parts

-

2,050

$8.743

$8.306

$7.869

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Andel Nordic

Denmark . 2,174 parts In-Stock

1+ parts

$9.144

100+ parts

-

1k+ parts

$8.779

10k+ parts

$8.779

2,174

$9.144

-

$8.779

$8.779

AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$9.246

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563

$9.246

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Ampacity Inc.

Singapore . 766 parts In-Stock

1+ parts

$11.000

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766

$11.000

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One Stop Electronics

USA . 531 parts In-Stock

1+ parts

$40.000

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531

$40.000

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Corphita

USA . 2,789 parts In-Stock

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2,789

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Microchip USA

USA . 402 parts In-Stock

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402

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Overview

Enhance the performance of your electronic devices with the Texas Instruments CDCF2509PWG4 Clock Drivers & Buffers. Manufactured by a trusted industry leader, this product provides reliable clock distribution for various applications. With its high-quality materials and advanced technology, it ensures precise timing and optimal signal integrity. Say goodbye to timing issues and signal disruptions - experience seamless operation and improved efficiency with the CDCF2509PWG4. Trust Texas Instruments to deliver superior quality and performance in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the clock driver/buffer.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more convenient in various electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this clock driver/buffer can function reliably even in high-temperature environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures versatility and reliability in different temperature conditions.

Technology: BICMOS

The use of BICMOS technology provides a combination of high-speed performance and low power consumption, making this product an efficient choice for clock driving and buffering applications.

Technical Specifications

Clock Drivers & Buffers CDCF2509PWG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2509

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

9

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

140 MHz

Trade Compliance

CDCF2509PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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