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CDCF2509PWRG4

Texas Instruments

CDCF2509PWRG4 by Texas Instruments

CDCF2509PWRG4 clock driver by Texas Instruments operates at 3.3V, with 24 terminals in a small outline package. It features a max output current of 14A, operating temperature range of 0-70°C, and supports up to 140MHz frequency applications. Ideal for commercial-grade systems requiring precise clock signal distribution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 15,170 parts In-Stock

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Vyrian

USA . 7,865 parts In-Stock

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7,865

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Digiode

USA . 2,661 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 500 parts In-Stock

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$1.404

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500

$1.404

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Northwest PG Solutions

USA . 2,125 parts In-Stock

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$1.545

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$1.545

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Andel Nordic

Denmark . 3,952 parts In-Stock

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$3.399

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$3.263

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$3.263

3,952

$3.399

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$3.263

$3.263

AZTECH Wire

Italy . 496 parts In-Stock

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$12.765

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496

$12.765

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Parana Technologies

USA . 1,313 parts In-Stock

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$17.136

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$17.350

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$17.136

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$17.350

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DigiPath Technology Company

USA . 1,320 parts In-Stock

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$18.869

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$17.359

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$18.869

$17.359

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ChromeModa Solutions

Germany . 2,115 parts In-Stock

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$19.254

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$15.788

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$19.254

$15.788

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

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$19.254

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$18.291

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$17.329

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One Stop Electronics

USA . 1,338 parts In-Stock

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$60.000

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Corphita

USA . 4,181 parts In-Stock

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Microchip USA

USA . 2,172 parts In-Stock

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Overview

Enhance your electronic designs with the CDCF2509PWRG4 by Texas Instruments, a top-tier manufacturer known for industry-leading quality and reliability. As part of the Clock Drivers & Buffers category, this product offers unparalleled precision and performance for a wide range of applications. With its innovative design and advanced features, customers can expect superior value, efficiency, and seamless integration into their projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and takes your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it suitable for a range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common in many electronic systems and ensures compatibility with existing setups.

Maximum I (ol): 14 Amp

The high output current capability of 14 Amps allows for driving multiple loads without the need for external buffers.

Maximum Operating Temperature: 70 °C

The wide operating temperature range of up to 70°C ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

The product can operate at temperatures as low as 0°C, making it suitable for a wide range of applications.

Width: 4.4 mm

The compact width of 4.4 mm saves space on the circuit board, allowing for more efficient layout designs.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V ensures compatibility with a variety of power sources and systems.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high performance with low power consumption.

Technical Specifications

Clock Drivers & Buffers CDCF2509PWRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2509

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

14 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

9

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

140 MHz

Trade Compliance

CDCF2509PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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