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CDCF5801DBQG4

Texas Instruments

CDCF5801DBQG4 by Texas Instruments

CDCF5801DBQG4 clock driver by Texas Instruments operates at 3.3V, with a max I (ol) of 16A and output characteristics in 3-STATE. It is used in industrial applications, featuring a CMOS technology, GULL WING terminal form, and a package style of SMALL OUTLINE, SHRINK PITCH.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,726 parts In-Stock

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Digiode

USA . 241 parts In-Stock

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241

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Distributors (Availability)

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Andel Nordic

Denmark . 5,833 parts In-Stock

1+ parts

$6.565

100+ parts

-

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$6.302

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$6.302

5,833

$6.565

-

$6.302

$6.302

AZTECH Wire

Italy . 609 parts In-Stock

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$10.152

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609

$10.152

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Native Components

USA . 805 parts In-Stock

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$15.706

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805

$15.706

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Northwest PG Solutions

USA . 1,291 parts In-Stock

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$17.277

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$15.549

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1,291

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$15.549

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Parana Technologies

USA . 392 parts In-Stock

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$20.179

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$20.135

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392

$20.179

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$20.135

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DigiPath Technology Company

USA . 2,351 parts In-Stock

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$22.220

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$22.220

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ChromeModa Solutions

Germany . 2,754 parts In-Stock

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$22.673

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$18.592

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$22.673

$18.592

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

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$22.673

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$21.539

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$20.406

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$20.406

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One Stop Electronics

USA . 222 parts In-Stock

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$61.000

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$61.000

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Component Stockers USA

USA . 710 parts In-Stock

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$99.990

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710

$99.990

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Corphita

USA . 2,828 parts In-Stock

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Microchip USA

USA . 1,218 parts In-Stock

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Overview

Enhance your electronic projects with the CDCF5801DBQG4 from Texas Instruments, a top-tier manufacturer known for its high-quality clock drivers and buffers. This versatile component offers exceptional value, providing precise timing solutions for a wide range of applications. With advanced features and reliable performance, this product ensures optimal functionality and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the CDCF5801DBQG4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

The surface mount feature enables easy and secure installation of the product on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, making it a versatile choice for different applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, ensuring stable and reliable performance in various environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for tristate logic operation, providing flexibility and efficiency in controlling the output signals.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product a reliable choice for clock drivers and buffers.

Minimum fmax: 280 MHz

The minimum fmax of 280 MHz indicates high-speed performance, making this product suitable for driving clock signals in fast-paced applications.

Technical Specifications

Clock Drivers & Buffers CDCF5801DBQG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

DIFFERENTIAL/SINGLE-ENDED OUTPUT AVAILABLE

Family:

5801

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

280 MHz

Trade Compliance

CDCF5801DBQG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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