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CDCF2510PWLE

Texas Instruments

CDCF2510PWLE by Texas Instruments

CDCF2510PWLE clock driver by Texas Instruments operates at 3.3V with 10 true outputs, supporting a max frequency of 140MHz. Its small outline package is ideal for surface mount applications in temperature range of 0-85°C, making it suitable for various electronic devices requiring precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,189 parts In-Stock

1+ parts

-

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3,189

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Digiode

USA . 1,729 parts In-Stock

1+ parts

-

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-

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1,729

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 833 parts In-Stock

1+ parts

$5.847

100+ parts

-

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833

$5.847

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Andel Nordic

Denmark . 1,627 parts In-Stock

1+ parts

$6.326

100+ parts

-

1k+ parts

$6.073

10k+ parts

$6.073

1,627

$6.326

-

$6.073

$6.073

Parana Technologies

USA . 1,883 parts In-Stock

1+ parts

$20.506

100+ parts

-

1k+ parts

$20.573

10k+ parts

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1,883

$20.506

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$20.573

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One Stop Electronics

USA . 341 parts In-Stock

1+ parts

$21.000

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-

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341

$21.000

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DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$22.579

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-

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526

$22.579

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ChromeModa Solutions

Germany . 4,006 parts In-Stock

1+ parts

$23.040

100+ parts

$18.893

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4,006

$23.040

$18.893

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IDEA Electronic Components Group

UK . 1,696 parts In-Stock

1+ parts

$23.040

100+ parts

$21.888

1k+ parts

$20.736

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1,696

$23.040

$21.888

$20.736

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Native Components

USA . 795 parts In-Stock

1+ parts

$158.660

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$152.314

795

$158.660

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$152.314

Northwest PG Solutions

USA . 2,290 parts In-Stock

1+ parts

$174.526

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2,290

$174.526

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Corphita

USA . 3,222 parts In-Stock

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3,222

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Overview

Enhance your electronic designs with the CDCF2510PWLE by Texas Instruments. As a leading manufacturer in clock drivers & buffers, Texas Instruments delivers unmatched quality and reliability. This versatile product is perfect for applications requiring precise timing control. With its compact design and advanced features, this clock driver offers exceptional value and performance. Trust Texas Instruments to provide innovative solutions for your electronic projects.

Feature Benefit Bullets

Package Body Material: Plastic/Epoxy

The use of plastic/epoxy material makes the package durable and resistant to physical damage, ensuring a longer lifespan for the product.

Surface Mount: Yes

Being surface mountable makes installation and assembly easier, saving time and effort in the production process.

Nominal Supply Voltage / Vsup (V): 3.3

The operating voltage of 3.3V is common in many applications, making this product compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand heat and operate reliably in various environments.

Width: 4.4 mm

The compact width of 4.4 mm allows for space-efficient design and placement in tight spaces within electronic devices.

Technical Specifications

Clock Drivers & Buffers CDCF2510PWLE attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDCF

Input Conditioning:

MUX

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

140 MHz

Trade Compliance

CDCF2510PWLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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