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CDCF5801ADBQRG4

Texas Instruments

CDCF5801ADBQRG4 by Texas Instruments

CDCF5801ADBQRG4 clock driver by Texas Instruments operates at 3.3V, with a max frequency of 280MHz and 24 terminals in a small outline package. Ideal for industrial applications requiring precise timing control and signal buffering.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,126 parts In-Stock

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Digiode

USA . 3,077 parts In-Stock

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3,077

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Distributors (Availability)

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One Stop Electronics

USA . 562 parts In-Stock

1+ parts

$8.000

100+ parts

-

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562

$8.000

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AZTECH Wire

Italy . 851 parts In-Stock

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$8.652

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851

$8.652

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Andel Nordic

Denmark . 3,070 parts In-Stock

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$11.542

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$11.080

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$11.080

3,070

$11.542

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$11.080

$11.080

Parana Technologies

USA . 693 parts In-Stock

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$19.829

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$19.786

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693

$19.829

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$19.786

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Native Components

USA . 928 parts In-Stock

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$20.310

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928

$20.310

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ChromeModa Solutions

Germany . 2,563 parts In-Stock

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$22.280

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$18.270

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2,563

$22.280

$18.270

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IDEA Electronic Components Group

UK . 358 parts In-Stock

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$22.280

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$21.166

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$20.052

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358

$22.280

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$20.052

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Northwest PG Solutions

USA . 611 parts In-Stock

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$22.341

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$20.107

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611

$22.341

$20.107

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Corphita

USA . 2,235 parts In-Stock

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DigiPath Technology Company

USA . 2,032 parts In-Stock

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$20.088

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Microchip USA

USA . 936 parts In-Stock

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Kepictronics

USA . 920 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the CDCF5801ADBQRG4 by Texas Instruments, a top-notch Clock Driver & Buffer designed to meet high industry standards. With Texas Instruments' reputation for excellence in manufacturing, this product ensures reliability and durability in various applications. Enjoy the benefits of improved signal integrity, reduced jitter, and enhanced overall system efficiency. Upgrade your electronics today with the CDCF5801ADBQRG4 and experience the quality and value that Texas Instruments delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and flexibility for the package, making it resistant to environmental factors and ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs during manufacturing.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and stable supply voltage of 3.3V, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, ensuring reliable performance in demanding industrial environments.

Technology: CMOS

Uses CMOS technology which offers low power consumption and high noise immunity, making it efficient and reliable for clock driver applications.

Technical Specifications

Clock Drivers & Buffers CDCF5801ADBQRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

DIFFERENTIAL/SINGLE-ENDED OUTPUT AVAILABLE

Family:

5801

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

40 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Minimum fmax:

280 MHz

Trade Compliance

CDCF5801ADBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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