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CDC351IDWG4

Texas Instruments

CDC351IDWG4 by Texas Instruments

Texas Instruments CDC351IDWG4 is Clock Driver & Buffer with 4.2ns Propagation Delay, 3.3V Supply Voltage, and 50pF Load Capacitance. Ideal for industrial applications due to -40 to 85°C operating temperature range and BICMOS technology. Package style: Small Outline, Surface Mountable with 24 terminals in Gull Wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,071 parts In-Stock

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6,071

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Digiode

USA . 2,732 parts In-Stock

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2,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,564 parts In-Stock

1+ parts

$5.485

100+ parts

-

1k+ parts

$5.266

10k+ parts

$5.266

3,564

$5.485

-

$5.266

$5.266

AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$16.293

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-

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418

$16.293

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One Stop Electronics

USA . 164 parts In-Stock

1+ parts

$23.000

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-

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164

$23.000

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Parana Technologies

USA . 61 parts In-Stock

1+ parts

$23.756

100+ parts

-

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$24.385

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61

$23.756

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$24.385

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DigiPath Technology Company

USA . 924 parts In-Stock

1+ parts

$26.158

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924

$26.158

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$26.692

100+ parts

$25.357

1k+ parts

$24.023

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1,542

$26.692

$25.357

$24.023

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ChromeModa Solutions

Germany . 228 parts In-Stock

1+ parts

$26.692

100+ parts

$21.887

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228

$26.692

$21.887

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Native Components

USA . 125 parts In-Stock

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$103.410

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$99.274

125

$103.410

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$99.274

Northwest PG Solutions

USA . 2,176 parts In-Stock

1+ parts

$113.751

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2,176

$113.751

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Corphita

USA . 3,089 parts In-Stock

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3,089

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Microchip USA

USA . 2,136 parts In-Stock

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Overview

Upgrade your clock driver solutions with the CDC351IDWG4 by Texas Instruments. Crafted with precision and expertise, this clock driver & buffer offers unparalleled performance and reliability for a wide range of applications. With a nominal supply voltage of 3.3V and a propagation delay of just 4.2ns, this product ensures seamless operation and high-speed data transmission. Whether you're in the telecommunications industry or working on advanced computing systems, the CDC351IDWG4 delivers exceptional value, efficiency, and quality that will elevate your projects to new heights. Trust Texas Instruments for cutting-edge technology that never disappoints.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 4.2 ns

Fast propagation delay ensures quick and efficient operation of the clock driver.

Surface Mount: YES

Easily mountable on circuit boards, saving space and simplifying the installation process.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages in electronic devices.

Output Characteristics: 3-STATE

Offers flexibility in controlling the output signal, enhancing the versatility of the clock driver.

Technical Specifications

Clock Drivers & Buffers CDC351IDWG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

4.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.9 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC351IDWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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