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CDC304D

Texas Instruments

CDC304D by Texas Instruments

The Texas Instruments CDC304D clock driver has a propagation delay of 9ns at 5V, with 8 true outputs and max frequency of 80MHz. It is used in applications requiring precise timing control, such as data communication systems and digital signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,982 parts In-Stock

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8,982

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Digiode

USA . 884 parts In-Stock

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884

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 979 parts In-Stock

1+ parts

$7.239

100+ parts

-

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979

$7.239

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AZTECH Wire

Italy . 275 parts In-Stock

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$9.216

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275

$9.216

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Andel Nordic

Denmark . 5,016 parts In-Stock

1+ parts

$9.344

100+ parts

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$8.970

10k+ parts

$8.970

5,016

$9.344

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$8.970

$8.970

Parana Technologies

USA . 403 parts In-Stock

1+ parts

$18.440

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$18.559

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403

$18.440

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$18.559

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ChromeModa Solutions

Germany . 4,136 parts In-Stock

1+ parts

$20.719

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$16.990

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4,136

$20.719

$16.990

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IDEA Electronic Components Group

UK . 1,869 parts In-Stock

1+ parts

$20.719

100+ parts

$19.683

1k+ parts

$18.647

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1,869

$20.719

$19.683

$18.647

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One Stop Electronics

USA . 694 parts In-Stock

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$52.000

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694

$52.000

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Kepictronics

USA . 1,772 parts In-Stock

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1,772

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DigiPath Technology Company

USA . 1,492 parts In-Stock

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$18.680

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$18.680

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Corphita

USA . 844 parts In-Stock

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844

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Northwest PG Solutions

USA . 576 parts In-Stock

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$7.094

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576

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$7.094

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Overview

Elevate your electronics projects with the Texas Instruments CDC304D clock driver and buffer. Crafted with precision and expertise, this product ensures top-notch quality and reliability. Perfect for a wide range of applications in the clock drivers & buffers category, the CDC304D offers impeccable performance and efficiency. With its fast propagation delay and low power consumption, this small outline package is a game-changer for any project. Trust Texas Instruments to provide you with the tools you need to succeed in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product reliable and easy to handle.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures efficient performance and fast signal transmission.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with a common supply voltage, making it versatile for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle slightly higher voltages, providing a margin of safety for the components.

Technology: TTL

TTL technology ensures reliable and robust signal processing.

Minimum fmax: 80 MHz

High maximum frequency allows for fast data processing and operation in demanding applications.

Technical Specifications

Clock Drivers & Buffers CDC304D attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Minimum fmax:

80 MHz

Trade Compliance

CDC304D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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