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CDC303N

Texas Instruments

CDC303N by Texas Instruments

The Texas Instruments CDC303N is a clock driver with 9ns propagation delay at 5V, suitable for TTL technology. It features 6 true outputs and 2 inverted outputs, ideal for applications requiring precise timing control in commercial temperature environments. With a compact rectangular package style and through-hole terminal form, it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,827 parts In-Stock

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Digiode

USA . 1,581 parts In-Stock

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1,581

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Distributors (Availability)

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One Stop Electronics

USA . 1,243 parts In-Stock

1+ parts

$11.000

100+ parts

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1,243

$11.000

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AZTECH Wire

Italy . 449 parts In-Stock

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$13.958

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449

$13.958

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Parana Technologies

USA . 378 parts In-Stock

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$15.340

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$15.732

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378

$15.340

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$15.732

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DigiPath Technology Company

USA . 1,895 parts In-Stock

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$16.891

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1,895

$16.891

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ChromeModa Solutions

Germany . 4,087 parts In-Stock

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$17.236

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$14.134

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4,087

$17.236

$14.134

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IDEA Electronic Components Group

UK . 205 parts In-Stock

1+ parts

$17.236

100+ parts

$16.374

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$15.512

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205

$17.236

$16.374

$15.512

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Native Components

USA . 482 parts In-Stock

1+ parts

$295.920

100+ parts

$290.002

1k+ parts

$287.042

10k+ parts

$284.083

482

$295.920

$290.002

$287.042

$284.083

Northwest PG Solutions

USA . 1,695 parts In-Stock

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$325.512

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1,695

$325.512

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A-Z Elektronik GmbH

Germany . 5,133 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,422 parts In-Stock

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Corphita

USA . 1,133 parts In-Stock

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Kepictronics

USA . 319 parts In-Stock

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319

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Metaverse IC Inc.

Canada . 300 parts In-Stock

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Overview

Enhance your electronic projects with the CDC303N Clock Drivers & Buffers from Texas Instruments. With a focus on quality and precision, Texas Instruments delivers a product that ensures reliable performance and seamless integration. Ideal for a wide range of applications, this clock driver offers customers value by providing fast propagation delay and standard input conditioning. Experience the benefits of smooth operation and enhanced efficiency with the CDC303N – the perfect solution for all your timing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 9 ns

Fast propagation delay ensures quick signal processing and synchronization, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with various systems and applications.

No. of Terminals: 16

Offers flexibility for connecting to multiple components in a system.

Maximum I (ol): 48 Amp

High output current capability allows for driving multiple loads without external amplification.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, suitable for different environmental conditions.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial-grade applications, ensuring compatibility and quality.

Technology: TTL

Utilizing TTL technology provides reliable and efficient clock signal distribution.

Minimum fmax: 80 MHz

Supports high-frequency clock signals, making it suitable for advanced electronic devices and systems.

Technical Specifications

Clock Drivers & Buffers CDC303N attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

2

No. of Terminals:

16

No. of True Outputs:

6

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

5.08 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Minimum fmax:

80 MHz

Trade Compliance

CDC303N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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