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CDC318ADLG4

Texas Instruments

CDC318ADLG4 by Texas Instruments

CDC318ADLG4 clock driver by Texas Instruments features a propagation delay of 4.5 ns, 48 terminals, and operates at a supply voltage of 3.3V. It is ideal for applications requiring precise timing synchronization in electronic systems.

Median Price

$13.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 73 parts In-Stock

1+ parts

$13.140

100+ parts

$6.540

1k+ parts

-

10k+ parts

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73

$13.140

$6.540

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,154 parts In-Stock

1+ parts

$9.738

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1,154

$9.738

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Vyrian

USA . 5,330 parts In-Stock

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-

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5,330

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Distributors (Availability)

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Native Components

USA . 93 parts In-Stock

1+ parts

$0.682

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-

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93

$0.682

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Northwest PG Solutions

USA . 453 parts In-Stock

1+ parts

$0.750

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-

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453

$0.750

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Andel Nordic

Denmark . 1,614 parts In-Stock

1+ parts

$4.168

100+ parts

-

1k+ parts

$4.002

10k+ parts

$4.002

1,614

$4.168

-

$4.002

$4.002

Corphita

USA . 1,132 parts In-Stock

1+ parts

$9.225

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1,132

$9.225

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Component Stockers USA

USA . 66 parts In-Stock

1+ parts

$10.110

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66

$10.110

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Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

$24.266

100+ parts

-

1k+ parts

$24.921

10k+ parts

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1,886

$24.266

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$24.921

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ChromeModa Solutions

Germany . 4,684 parts In-Stock

1+ parts

$27.265

100+ parts

$22.357

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4,684

$27.265

$22.357

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IDEA Electronic Components Group

UK . 353 parts In-Stock

1+ parts

$27.265

100+ parts

$25.902

1k+ parts

$24.538

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353

$27.265

$25.902

$24.538

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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DigiPath Technology Company

USA . 2,268 parts In-Stock

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$24.582

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2,268

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$24.582

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Microchip USA

USA . 1,599 parts In-Stock

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1,599

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Overview

Experience precision and reliability with the CDC318ADLG4 by Texas Instruments, a leading manufacturer in clock drivers & buffers. This versatile product offers high-quality performance for a wide range of applications, ensuring seamless operation and efficiency. With a nominal supply voltage of 3.3V and a propagation delay of just 4.5ns, this small outline package is designed to deliver exceptional results. Trust in Texas Instruments to provide cutting-edge technology and unmatched value for your electronic needs. Elevate your projects with the CDC318ADLG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the product.

Propagation Delay At Nominal Supply: 4.5 ns

Ensures fast signal processing and minimized delay.

Surface Mount: YES

Enables easy and efficient installation on PCBs.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently within the standard supply voltage range.

No. of Terminals: 48

Offers a sufficient number of connections for different functionalities.

Maximum I (ol): 24 Amp

Can handle high output currents, suitable for various applications.

Output Characteristics: 3-STATE

Provides flexibility in output states for improved compatibility.

Minimum Operating Temperature: 0 °C

Can operate reliably in low-temperature environments.

Temperature Grade: COMMERCIAL

Suitable for standard commercial use cases.

Technology: BICMOS

Utilizes BiCMOS technology for enhanced performance and efficiency.

Technical Specifications

Clock Drivers & Buffers CDC318ADLG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

318

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

2.79 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC318ADLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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