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CDC319DBLE

Texas Instruments

CDC319DBLE by Texas Instruments

The Texas Instruments CDC319DBLE clock driver has a propagation delay of 150ns, operates at 3.3V, and offers 10 true outputs. It is used in applications requiring precise timing control and signal synchronization in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,806 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,806

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Digiode

USA . 2,867 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,867

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,906 parts In-Stock

1+ parts

$1.586

100+ parts

-

1k+ parts

$1.522

10k+ parts

$1.522

5,906

$1.586

-

$1.522

$1.522

Northwest PG Solutions

USA . 515 parts In-Stock

1+ parts

$2.872

100+ parts

-

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-

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515

$2.872

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-

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AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$6.994

100+ parts

-

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622

$6.994

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Parana Technologies

USA . 1,441 parts In-Stock

1+ parts

$20.063

100+ parts

$1,863.179

1k+ parts

$18.057

10k+ parts

-

1,441

$20.063

$1,863.179

$18.057

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DigiPath Technology Company

USA . 239 parts In-Stock

1+ parts

$22.092

100+ parts

$20.325

1k+ parts

-

10k+ parts

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239

$22.092

$20.325

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IDEA Electronic Components Group

UK . 1,372 parts In-Stock

1+ parts

$22.543

100+ parts

$21.416

1k+ parts

$20.289

10k+ parts

-

1,372

$22.543

$21.416

$20.289

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ChromeModa Solutions

Germany . 1,279 parts In-Stock

1+ parts

$22.543

100+ parts

$18.485

1k+ parts

-

10k+ parts

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1,279

$22.543

$18.485

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One Stop Electronics

USA . 1,384 parts In-Stock

1+ parts

$56.000

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1,384

$56.000

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Corphita

USA . 1,460 parts In-Stock

1+ parts

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1,460

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Native Components

USA . 437 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.533

10k+ parts

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437

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$2.533

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Overview

Experience superior clock signal distribution with the Texas Instruments CDC319DBLE Clock Driver & Buffer. Manufactured by a trusted industry leader, this product offers reliable performance and precision timing for a wide range of applications. From networking to telecommunications, this clock driver ensures optimal signal integrity and synchronization, making it an essential component for your electronic systems. Unlock the benefits of high-quality clock distribution with the CDC319DBLE and elevate your design with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package, ensuring the product can withstand tough operating conditions.

Propagation Delay At Nominal Supply: 150 ns

Fast propagation delay at nominal supply voltage ensures efficient operation and minimal delay in signal transmission, making it suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V ensures compatibility with common power sources, making integration into existing systems seamless.

Maximum I (ol): 6 Amp

High output current capability of 6A enables driving of multiple loads or components without the need for external amplifiers, providing versatility in design.

Minimum Supply Voltage (Vsup): 3.135 V

Low minimum supply voltage requirement allows for operation in systems with limited power availability, catering to a wide range of applications.

Technical Specifications

Clock Drivers & Buffers CDC319DBLE attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

150 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC319DBLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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