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CDC304DR

Texas Instruments

CDC304DR by Texas Instruments

The Texas Instruments CDC304DR is a Clock Driver & Buffer with 9ns Propagation Delay at 5V. It has 8 True Outputs, operates up to 80MHz, and is ideal for applications requiring precise clock signal distribution in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,368 parts In-Stock

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8,368

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Bristol Electronics

USA . 2,266 parts In-Stock

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2,266

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Digiode

USA . 1,198 parts In-Stock

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1,198

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 88 parts In-Stock

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88

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Native Components

USA . 899 parts In-Stock

1+ parts

$0.590

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899

$0.590

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Northwest PG Solutions

USA . 556 parts In-Stock

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$0.649

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556

$0.649

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Andel Nordic

Denmark . 4,953 parts In-Stock

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$8.302

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$7.970

10k+ parts

$7.970

4,953

$8.302

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$7.970

$7.970

Ampacity Inc.

Singapore . 372 parts In-Stock

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$13.000

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372

$13.000

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Parana Technologies

USA . 58 parts In-Stock

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$17.706

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$17.890

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58

$17.706

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$17.890

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AZTECH Wire

Italy . 490 parts In-Stock

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$17.845

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490

$17.845

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DigiPath Technology Company

USA . 1,446 parts In-Stock

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$19.496

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$17.936

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$19.496

$17.936

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ChromeModa Solutions

Germany . 6,139 parts In-Stock

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$19.894

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$16.313

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$19.894

$16.313

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IDEA Electronic Components Group

UK . 466 parts In-Stock

1+ parts

$19.894

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$18.899

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$17.905

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466

$19.894

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$17.905

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One Stop Electronics

USA . 1,076 parts In-Stock

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$64.000

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Corphita

USA . 1,536 parts In-Stock

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1,536

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Overview

Experience superior performance and reliability with the Texas Instruments CDC304DR Clock Driver & Buffer. Crafted by a leading manufacturer in the industry, this product offers unmatched quality and precision. Ideal for a wide range of applications, this clock driver ensures efficient signal transmission and synchronization. With fast propagation delay and a small outline package style, the CDC304DR is perfect for demanding environments where timing accuracy is crucial. Trust Texas Instruments to deliver unparalleled value and benefits to meet your needs. Choose the CDC304DR for exceptional performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Easy to install on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage that is widely compatible with various systems and components.

No. of True Outputs: 8

Provides multiple output channels, allowing for versatile connectivity and signal distribution.

Minimum fmax: 80 MHz

High maximum frequency enables fast data processing and communication within the system.

Technical Specifications

Clock Drivers & Buffers CDC304DR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Minimum fmax:

80 MHz

Trade Compliance

CDC304DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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