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CDC319DBG4

Texas Instruments

CDC319DBG4 by Texas Instruments

The Texas Instruments CDC319DBG4 is a clock driver with 150ns propagation delay, 3.6ns tpd, and 10 true outputs. It operates at 3.3V and is ideal for applications requiring precise timing synchronization in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,340 parts In-Stock

1+ parts

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Digiode

USA . 4,239 parts In-Stock

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4,239

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Vyrian

USA . 2,139 parts In-Stock

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2,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,060 parts In-Stock

1+ parts

$2.893

100+ parts

-

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1,060

$2.893

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One Stop Electronics

USA . 140 parts In-Stock

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$3.000

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-

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140

$3.000

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Andel Nordic

Denmark . 4,342 parts In-Stock

1+ parts

$4.653

100+ parts

-

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$4.466

10k+ parts

$4.466

4,342

$4.653

-

$4.466

$4.466

AZTECH Wire

Italy . 367 parts In-Stock

1+ parts

$6.958

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367

$6.958

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Parana Technologies

USA . 868 parts In-Stock

1+ parts

$28.826

100+ parts

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$52.260

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868

$28.826

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$52.260

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DigiPath Technology Company

USA . 2,163 parts In-Stock

1+ parts

$31.741

100+ parts

$29.202

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2,163

$31.741

$29.202

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ChromeModa Solutions

Germany . 3,562 parts In-Stock

1+ parts

$32.389

100+ parts

$26.559

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3,562

$32.389

$26.559

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IDEA Electronic Components Group

UK . 1,965 parts In-Stock

1+ parts

$32.389

100+ parts

$30.770

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$29.150

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1,965

$32.389

$30.770

$29.150

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$34.785

100+ parts

$31.654

1k+ parts

$28.524

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15

$34.785

$31.654

$28.524

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A-Z Elektronik GmbH

Germany . 5,984 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,989 parts In-Stock

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Corphita

USA . 3,646 parts In-Stock

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Kepictronics

USA . 69 parts In-Stock

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69

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Native Components

USA . 64 parts In-Stock

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$2.551

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64

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$2.551

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Overview

Unlock precision timing and reliability with the CDC319DBG4 by Texas Instruments. Crafted with top-tier quality and expertise, this clock driver and buffer is perfect for a wide range of applications. From ensuring smooth data transmission to enhancing system performance, this product offers unmatched value and benefits to customers. Say goodbye to delays and errors, and hello to seamless operation with the CDC319DBG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 150 ns

The low propagation delay ensures fast and efficient signal transmission within the clock driver, resulting in accurate timing synchronization.

Surface Mount: YES

The surface mount capability makes the installation of the clock driver easy and convenient, saving space on the circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in electronic devices, making this clock driver compatible with a wide range of applications.

Load Capacitance (CL): 30 pF

The low load capacitance ensures minimal signal distortion and loss, maintaining signal integrity in high-speed clock distribution systems.

Maximum Operating Temperature: 70 °C

The high operating temperature range makes this clock driver suitable for industrial and automotive applications where temperature fluctuations are common.

No. of True Outputs: 10

Having 10 true outputs allows for multiple clock signals to be generated simultaneously, improving system performance and synchronization.

Technical Specifications

Clock Drivers & Buffers CDC319DBG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

319

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

150 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

CDC319DBG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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