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CC2564RVMT

Texas Instruments

CC2564RVMT by Texas Instruments

CC2564RVMT by Texas Instruments is a telecom IC with 76 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features matte tin terminal finish and very thin profile design for industrial applications.

Median Price

$4.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

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250

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Rochester

USA . 4 parts In-Stock

1+ parts

-

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$4.470

1k+ parts

$4.000

10k+ parts

$3.760

4

-

$4.470

$4.000

$3.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,974 parts In-Stock

1+ parts

$4.218

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4,974

$4.218

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Sensible Micro Corp

USA . 4,729 parts In-Stock

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4,729

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Vyrian

USA . 4,257 parts In-Stock

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4,257

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Ashlea Components Ltd

UK . 182 parts In-Stock

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182

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Distributors (Availability)

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Corphita

USA . 3,599 parts In-Stock

1+ parts

$3.996

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3,599

$3.996

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Parana Technologies

USA . 1,076 parts In-Stock

1+ parts

$10.239

100+ parts

-

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$10.772

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1,076

$10.239

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$10.772

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$11.444

100+ parts

$10.414

1k+ parts

$9.384

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-

350

$11.444

$10.414

$9.384

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ChromeModa Solutions

Germany . 5,127 parts In-Stock

1+ parts

$11.504

100+ parts

$9.433

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5,127

$11.504

$9.433

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IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$11.504

100+ parts

$10.929

1k+ parts

$10.354

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-

792

$11.504

$10.929

$10.354

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QUARKTWIN TECHNOLOGY LTD

USA . 3,886 parts In-Stock

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DigiPath Technology Company

USA . 1,311 parts In-Stock

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$10.372

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1,311

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$10.372

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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S.R.D Solutions

India . 500 parts In-Stock

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500

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Metaverse IC Inc.

Canada . 497 parts In-Stock

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497

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Kepictronics

USA . 397 parts In-Stock

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397

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Native Components

USA . 125 parts In-Stock

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125

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Northwest PG Solutions

USA . 41 parts In-Stock

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41

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Overview

Experience seamless connectivity with the Texas Instruments CC2564RVMT, a top-of-the-line telecom interface IC designed for optimal performance. Crafted with precision and expertise by Texas Instruments, this chip carrier boasts a very thin profile and matte tin finish for enhanced durability. Ideal for a wide range of applications, this industrial-grade telecom circuit guarantees reliability and efficiency. Upgrade your devices with the CC2564RVMT and discover unparalleled connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the IC, making it suitable for telecom applications where long-term performance is key.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, optimizing space on the PCB and allowing for efficient placement of other components.

No. of Terminals: 76

With a high number of terminals, this IC can support complex telecom interface circuits, enabling versatile functionality in communication systems.

Terminal Position: QUAD

Quad terminal positioning facilitates effective connections and signal transmissions within the IC, enhancing overall performance and reliability.

Nominal Supply Voltage: 3.6 V

Operating at a nominal supply voltage of 3.6V, this IC offers compatibility with commonly used power sources in telecom systems, ensuring seamless integration.

Technical Specifications

Other Function Telecom Interface ICs CC2564RVMT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N76

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

76

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.73 mm

Trade Compliance

CC2564RVMT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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