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BQ500414QRGZR

Texas Instruments

BQ500414QRGZR by Texas Instruments

BQ500414QRGZR by Texas Instruments is a Power Management IC with 48 terminals, operating temperature range of -40 to 110°C. It supports a nominal voltage of 3.3V and has a package style of CHIP CARRIER. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,687 parts In-Stock

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Digiode

USA . 2,064 parts In-Stock

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2,064

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Distributors (Availability)

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Ampacity Inc.

Singapore . 923 parts In-Stock

1+ parts

$0.500

100+ parts

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923

$0.500

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Native Components

USA . 305 parts In-Stock

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$0.725

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-

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305

$0.725

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Northwest PG Solutions

USA . 735 parts In-Stock

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$0.798

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735

$0.798

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One Stop Electronics

USA . 1,638 parts In-Stock

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$4.500

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1,638

$4.500

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Semicontronic

India . 1,147 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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1,147

$6.500

$6.338

$6.305

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Parana Technologies

USA . 403 parts In-Stock

1+ parts

$15.332

100+ parts

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$15.727

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403

$15.332

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$15.727

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AZTECH Wire

Italy . 463 parts In-Stock

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$16.441

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463

$16.441

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ChromeModa Solutions

Germany . 4,889 parts In-Stock

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$17.227

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$14.126

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4,889

$17.227

$14.126

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IDEA Electronic Components Group

UK . 2,075 parts In-Stock

1+ parts

$17.227

100+ parts

$16.366

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$15.504

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2,075

$17.227

$16.366

$15.504

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DigiPath Technology Company

USA . 1,481 parts In-Stock

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$15.532

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1,481

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$15.532

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Corphita

USA . 231 parts In-Stock

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Corohmni

South Africa . 230 parts In-Stock

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Overview

Elevate your power management solutions with the BQ500414QRGZR by Texas Instruments. Designed with quality in mind, this Power Management IC offers exceptional performance and reliability that you can trust. Ideal for a wide range of applications, this product stands out for its efficiency and versatility. Experience the convenience and peace of mind that comes with using a top-tier manufacturer like Texas Instruments, and take your projects to the next level with the BQ500414QRGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the IC, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in many electronic devices, making this IC compatible with a wide range of applications.

No. of Terminals: 48

Having 48 terminals allows for versatile connections and functionality, providing options for various circuit configurations.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature of 110°C, this IC can withstand harsh environmental conditions and maintain stable performance under heat.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in cold environments, enhancing the IC's versatility.

Width (mm): 7 mm

The compact width of 7mm saves space on the circuit board, making this IC suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications indicate that this IC is designed for rugged and demanding industrial applications, ensuring robust performance.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues and ensures compliance with environmental regulations, making this IC environmentally friendly.

Technical Specifications

Power Management ICs BQ500414QRGZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

BQ500414QRGZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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