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BQ500414QRGZTQ1

Texas Instruments

BQ500414QRGZTQ1 by Texas Instruments

BQ500414QRGZTQ1 by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V and a max operating temperature of 110°C. It is used as a power supply support circuit in industrial applications.

Median Price

$7.700

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$13.560

100+ parts

$8.700

1k+ parts

$7.430

10k+ parts

-

34

$13.560

$8.700

$7.430

-

Rochester

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$6.000

1k+ parts

$5.370

10k+ parts

$5.060

2,750

-

$6.000

$5.370

$5.060

DigiKey

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$7.900

1k+ parts

-

10k+ parts

-

2,750

-

$7.900

-

-

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$7.500

1k+ parts

$6.713

10k+ parts

$6.325

2,500

-

$7.500

$6.713

$6.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,922 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,922

$5.510

-

-

-

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$6.260

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$6.260

-

-

-

Vyrian

USA . 5,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,404

-

-

-

-

DigiKey Marketplace

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,750

-

-

-

-

VNN

France . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,547 parts In-Stock

1+ parts

$4.930

100+ parts

-

1k+ parts

-

10k+ parts

-

1,547

$4.930

-

-

-

Corphita

USA . 325 parts In-Stock

1+ parts

$5.220

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$5.220

-

-

-

Parana Technologies

USA . 2,071 parts In-Stock

1+ parts

$17.562

100+ parts

-

1k+ parts

$17.759

10k+ parts

-

2,071

$17.562

-

$17.759

-

DigiPath Technology Company

USA . 1,050 parts In-Stock

1+ parts

$19.338

100+ parts

-

1k+ parts

-

10k+ parts

-

1,050

$19.338

-

-

-

ChromeModa Solutions

Germany . 4,042 parts In-Stock

1+ parts

$19.733

100+ parts

$16.181

1k+ parts

-

10k+ parts

-

4,042

$19.733

$16.181

-

-

IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$19.733

100+ parts

$18.746

1k+ parts

$17.760

10k+ parts

-

1,705

$19.733

$18.746

$17.760

-

Microchip USA

USA . 278 parts In-Stock

1+ parts

$20.890

100+ parts

$20.740

1k+ parts

$20.740

10k+ parts

$20.590

278

$20.890

$20.740

$20.740

$20.590

Kepictronics

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$6.135

1k+ parts

$5.947

10k+ parts

$5.822

50

-

$6.135

$5.947

$5.822

Overview

Discover the power of BQ500414QRGZTQ1, brought to you by Texas Instruments! As a leader in Power Management ICs, Texas Instruments stands for quality and reliability. This innovative product offers a range of applications with its power supply support circuit. With a compact chip carrier package and a very thin profile, it's perfect for space-constrained designs. Its impressive operating temperature range and industrial-grade performance make it ideal for even the toughest environments. Experience the value and benefits of this cutting-edge technology, and unlock endless possibilities for your projects. Choose Texas Instruments and elevate your power management game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a plastic/epoxy body material which offers durability and cost-effectiveness.

Surface Mount: YES

Being surface mount compatible, this product allows for easy and efficient installation on circuit boards.

No. of Functions: 1

With one function included, this power management IC simplifies the design and integration process.

Screening Level: AEC-Q100

Designed with AEC-Q100 screening level, this product ensures high reliability and performance in automotive applications.

Package Shape: SQUARE

The square package shape offers efficient use of space on a circuit board, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3V, this power management IC provides a stable power source for compatible devices.

No. of Terminals: 48

Featuring 48 terminals, this IC allows for versatile connections and compatibility with a wide range of devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and very thin profile ensures effective heat dissipation and space-saving installation.

Maximum Operating Temperature: 110 °C

With a maximum operating temperature of 110°C, this product can handle high thermal stress, increasing its reliability in demanding environments.

Minimum Operating Temperature: -40 °C

This power management IC is designed to operate in low temperatures as low as -40°C, making it suitable for various operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: QUAD

With a quad terminal position, this IC offers convenient and secure connections, enhancing ease of use during installation and maintenance.

Maximum Seated Height: 1 mm

The maximum seated height of only 1mm contributes to a low-profile design, ideal for applications with limited space availability.

Width (mm): 7 mm

The 7mm width of this power management IC allows for compact integration within electronic systems.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC serves as a power supply support circuit, providing stable and reliable power distribution to connected devices.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this IC ensures compatibility with various power sources and devices.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature allows for efficient soldering and assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper thermal bonding during soldering, promoting strong and reliable connections.

Length: 7 mm

With a length of 7mm, this power management IC offers a compact and space-saving solution for circuit board layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this power management IC meets the necessary temperature requirements and performance standards.

No. of Channels: 1

This IC features one channel, providing a single pathway for power management and delivery, simplifying system design.

Terminal Form: NO LEAD

The no-lead terminal form of this IC eliminates the use of traditional leads, enhancing reliability and ease of assembly.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this IC allows for precise and compact connections, making it suitable for miniaturized applications.

Moisture Sensitivity Level (MSL): 3

Featuring MSL 3, this power management IC is resistant to moisture and humidity, ensuring long-term reliability even in challenging environments.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this IC can handle higher voltage inputs, expanding compatibility with various power sources.

Technical Specifications

Power Management ICs BQ500414QRGZTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

BQ500414QRGZTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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