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BQ500410ARGZR

Texas Instruments

BQ500410ARGZR by Texas Instruments

BQ500410ARGZR by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 110°C. It has a supply voltage of 3.3V and supports power supply circuits. The chip carrier package style with a very thin profile makes it suitable for industrial applications requiring compact design and efficient power management.

Median Price

$6.925

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

$5.540

1k+ parts

$4.960

10k+ parts

$4.660

50,000

-

$5.540

$4.960

$4.660

DigiKey

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

$7.290

1k+ parts

-

10k+ parts

-

50,000

-

$7.290

-

-

Verical

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

$6.925

1k+ parts

$6.200

10k+ parts

$5.825

50,000

-

$6.925

$6.200

$5.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,577 parts In-Stock

1+ parts

$5.082

100+ parts

-

1k+ parts

-

10k+ parts

-

2,577

$5.082

-

-

-

Vyrian

USA . 1,506 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,506

$5.350

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 52,356 parts In-Stock

1+ parts

$4.210

100+ parts

$4.000

1k+ parts

$3.880

10k+ parts

$4.660

52,356

$4.210

$4.000

$3.880

$4.660

Ampacity Inc.

Singapore . 49,885 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

-

49,885

$4.550

-

-

-

Semicontronic

India . 49,646 parts In-Stock

1+ parts

$4.550

100+ parts

$4.436

1k+ parts

$4.414

10k+ parts

-

49,646

$4.550

$4.436

$4.414

-

Corphita

USA . 438 parts In-Stock

1+ parts

$4.815

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$4.815

-

-

-

Corohmni

South Africa . 487 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

-

10k+ parts

-

487

$5.350

-

-

-

Native Components

USA . 565 parts In-Stock

1+ parts

$5.690

100+ parts

-

1k+ parts

-

10k+ parts

-

565

$5.690

-

-

-

Parana Technologies

USA . 2,315 parts In-Stock

1+ parts

$7.346

100+ parts

-

1k+ parts

$7.839

10k+ parts

-

2,315

$7.346

-

$7.839

-

DigiPath Technology Company

USA . 1,506 parts In-Stock

1+ parts

$8.089

100+ parts

$7.442

1k+ parts

-

10k+ parts

-

1,506

$8.089

$7.442

-

-

ChromeModa Solutions

Germany . 3,154 parts In-Stock

1+ parts

$8.254

100+ parts

$6.768

1k+ parts

-

10k+ parts

-

3,154

$8.254

$6.768

-

-

IDEA Electronic Components Group

UK . 2,242 parts In-Stock

1+ parts

$8.254

100+ parts

-

1k+ parts

$7.429

10k+ parts

-

2,242

$8.254

-

$7.429

-

Microchip USA

USA . 345 parts In-Stock

1+ parts

$14.170

100+ parts

$13.960

1k+ parts

$13.860

10k+ parts

$13.760

345

$14.170

$13.960

$13.860

$13.760

A-Z Elektronik GmbH

Germany . 6,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,035

-

-

-

-

Alle Elektronik GmbH

Germany . 4,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,023

-

-

-

-

Northwest PG Solutions

USA . 1,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.576

10k+ parts

-

1,602

-

-

$5.576

-

Kepictronics

USA . 197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

197

-

-

-

-

Overview

Unleash the power of your devices with the BQ500410ARGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that guarantee reliability and performance. Ideal for a wide range of applications, this innovative product offers customers unmatched value, benefits, and advantages. Upgrade your electronics with the BQ500410ARGZR and experience seamless power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

Stable supply voltage of 3.3V ensures consistent performance of the power management IC.

Maximum Operating Temperature: 110 °C

High maximum operating temperature of 110°C ensures the IC can withstand elevated temperatures in industrial environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

Width (mm): 7 mm

Compact width of 7mm makes this IC suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 3 V

Minimum supply voltage of 3V ensures compatibility with a range of power sources.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates the IC's suitability for harsh operating conditions.

Maximum Supply Current (Isup): 60 mA

Capable of supplying up to 60mA of current, making it suitable for powering various components.

Terminal Form: NO LEAD

No-lead terminal form improves reliability and offers better thermal conductivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC is sensitive to moisture to a moderate degree, requiring careful handling and storage.

Maximum Supply Voltage (Vsup): 3.6 V

Maximum supply voltage of 3.6V ensures compatibility with a range of power sources without risking damage to the IC.

Technical Specifications

Power Management ICs BQ500410ARGZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

BQ500410ARGZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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