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BQ50002RHBR

Texas Instruments

BQ50002RHBR by Texas Instruments

BQ50002RHBR by Texas Instruments is a Power Management IC with 32 terminals, operating b/w -40 to 125°C. It supports supply voltages from 4.5V to 5.5V and has a peak reflow temperature of 260°C. This chip carrier is ideal for automotive applications requiring power supply support circuits in a compact form factor.

Median Price

$1.488

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,030 parts In-Stock

1+ parts

$3.090

100+ parts

$1.911

1k+ parts

$1.697

10k+ parts

$1.605

8,030

$3.090

$1.911

$1.697

$1.605

Rochester

USA . 5,525 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.190

10k+ parts

$1.060

5,525

-

$1.430

$1.190

$1.060

Verical

USA . 5,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.488

10k+ parts

$1.325

5,525

-

-

$1.488

$1.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,008 parts In-Stock

1+ parts

$1.254

100+ parts

-

1k+ parts

-

10k+ parts

-

1,008

$1.254

-

-

-

Vyrian

USA . 888 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$1.320

-

-

-

DigiKey Marketplace

USA . 5,625 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

-

10k+ parts

-

5,625

-

$1.370

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 940 parts In-Stock

1+ parts

$1.188

100+ parts

-

1k+ parts

-

10k+ parts

-

940

$1.188

-

-

-

Native Components

USA . 407 parts In-Stock

1+ parts

$7.781

100+ parts

-

1k+ parts

-

10k+ parts

-

407

$7.781

-

-

-

Northwest PG Solutions

USA . 680 parts In-Stock

1+ parts

$8.559

100+ parts

$7.703

1k+ parts

-

10k+ parts

-

680

$8.559

$7.703

-

-

Microchip USA

USA . 341 parts In-Stock

1+ parts

$8.620

100+ parts

$8.600

1k+ parts

$8.600

10k+ parts

$8.570

341

$8.620

$8.600

$8.600

$8.570

Parana Technologies

USA . 1,525 parts In-Stock

1+ parts

$19.758

100+ parts

-

1k+ parts

$19.730

10k+ parts

-

1,525

$19.758

-

$19.730

-

DigiPath Technology Company

USA . 549 parts In-Stock

1+ parts

$21.756

100+ parts

$20.016

1k+ parts

-

10k+ parts

-

549

$21.756

$20.016

-

-

IDEA Electronic Components Group

UK . 1,787 parts In-Stock

1+ parts

$22.200

100+ parts

$21.090

1k+ parts

$19.980

10k+ parts

-

1,787

$22.200

$21.090

$19.980

-

ChromeModa Solutions

Germany . 1,151 parts In-Stock

1+ parts

$22.200

100+ parts

$18.204

1k+ parts

-

10k+ parts

-

1,151

$22.200

$18.204

-

-

Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Lixinc

USA . 902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

902

-

-

-

-

Overview

Experience top-notch power management with the BQ50002RHBR by Texas Instruments. Crafted with precision and quality, this Power Management IC offers unparalleled performance and reliability. Its applications in various devices make it a versatile choice for any project. With Texas Instruments as the manufacturer, you can trust in the expertise and innovation behind every product. Upgrade your power supply support circuit with the BQ50002RHBR and enjoy the benefits of efficiency and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for power management ICs as it provides good mechanical strength and insulation properties.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and improving reliability.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a standard requirement for many electronic devices, making this IC compatible with a wide range of applications.

No. of Terminals: 32

Having 32 terminals allows for more connections and functionalities, making this IC versatile for various power management tasks.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the IC can withstand demanding environmental conditions without compromising its performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature indicates that this IC can operate in cold environments without issues, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the IC.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures that this IC meets strict quality and reliability standards required for automotive applications where durability and performance are critical.

Technical Specifications

Power Management ICs BQ50002RHBR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ50002RHBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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