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INA234AIYBJR

Texas Instruments

INA234AIYBJR by Texas Instruments

Texas Instruments' INA234AIYBJR is a Power Management IC with 8 terminals and a supply voltage range of 1.7V to 5.5V. Featuring a very thin profile, fine pitch grid array package, it operates b/w -40°C to 125°C. Ideal for power supply support circuits, this IC offers an adjustable threshold voltage of 0.95V for various applications.

Median Price

$1.112

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,802 parts In-Stock

1+ parts

$1.112

100+ parts

$0.855

1k+ parts

$0.450

10k+ parts

-

9,802

$1.112

$0.855

$0.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.999

-

-

-

Digiode

USA . 572 parts In-Stock

1+ parts

$1.056

100+ parts

-

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-

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572

$1.056

-

-

-

Chip Stock

USA . 14,500 parts In-Stock

1+ parts

-

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14,500

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Vyrian

USA . 5,571 parts In-Stock

1+ parts

-

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-

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5,571

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,261 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

5,261

$0.520

-

-

-

Semicontronic

India . 5,200 parts In-Stock

1+ parts

$0.520

100+ parts

$0.507

1k+ parts

$0.504

10k+ parts

-

5,200

$0.520

$0.507

$0.504

-

Continental Prestige Electronics

USA . 3,257 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

$0.979

3,257

$0.999

-

-

$0.979

Argo Parts USA

USA . 2,329 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

2,329

$0.999

-

-

-

Corphita

USA . 4,943 parts In-Stock

1+ parts

$1.001

100+ parts

-

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-

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4,943

$1.001

-

-

-

Parana Technologies

USA . 1,532 parts In-Stock

1+ parts

$5.212

100+ parts

$483.998

1k+ parts

$4.691

10k+ parts

-

1,532

$5.212

$483.998

$4.691

-

DigiPath Technology Company

USA . 838 parts In-Stock

1+ parts

$5.739

100+ parts

-

1k+ parts

-

10k+ parts

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838

$5.739

-

-

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IDEA Electronic Components Group

UK . 2,224 parts In-Stock

1+ parts

$5.856

100+ parts

-

1k+ parts

$5.270

10k+ parts

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2,224

$5.856

-

$5.270

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ChromeModa Solutions

Germany . 1,916 parts In-Stock

1+ parts

$5.856

100+ parts

$4.802

1k+ parts

-

10k+ parts

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1,916

$5.856

$4.802

-

-

Microchip USA

USA . 3,912 parts In-Stock

1+ parts

$5.875

100+ parts

-

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3,912

$5.875

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Corohmni

South Africa . 323 parts In-Stock

1+ parts

$15.050

100+ parts

-

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323

$15.050

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-

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$19.919

100+ parts

$18.923

1k+ parts

$18.923

10k+ parts

-

300

$19.919

$18.923

$18.923

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QUARKTWIN TECHNOLOGY LTD

USA . 28,213 parts In-Stock

1+ parts

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28,213

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Lixinc

USA . 10,848 parts In-Stock

1+ parts

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10,848

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

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-

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.107

1k+ parts

$4.107

10k+ parts

$4.107

500

-

$4.107

$4.107

$4.107

Overview

Discover the power of the Texas Instruments INA234AIYBJR, a top-of-the-line Power Management IC that guarantees unmatched quality and reliability. With a sleek rectangular design and surface mount capability, this innovative product is perfect for a wide range of applications. From adjusting threshold voltage to providing power supply support, this IC offers unparalleled value and benefits to customers seeking superior performance and efficiency. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing overall assembly time.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that is compatible with a wide range of PCB designs and layouts.

Nominal Supply Voltage (Vsup): 3.3 V

Ideal supply voltage for a variety of applications, offering a balance between power efficiency and performance.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in the circuit, enabling versatile integration within power management systems.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package with a thin profile and fine pitch ensures high density mounting, allowing for compact and space-efficient designs.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability and functionality under various environmental conditions, making it suitable for different applications.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures extends the product's usability in diverse settings, including industrial and automotive environments.

Terminal Finish: TIN SILVER COPPER

Composite terminal finish provides corrosion resistance, excellent conductivity, and solderability, ensuring long-term durability and performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, enhancing the overall assembly process and facilitating efficient troubleshooting and maintenance.

Maximum Seated Height: 0.35 mm

Low seated height enables slim and compact designs, promoting space-saving benefits and enhancing overall system integration flexibility.

Width (mm): 0.745 mm

Narrow width facilitates placement in tight spaces on the PCB, allowing for efficient use of board real estate and enabling high-density packaging.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, offering optimized performance, reliability, and efficiency for power management applications.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage requirement allows for flexibility in different power input scenarios, catering to varying system specifications and constraints.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust soldering process compatibility and reliability during assembly, reducing the risk of component damage.

Length: 1.508 mm

Compact length dimension contributes to a space-efficient form factor, enabling streamlined integration in tight layouts and miniaturized device designs.

Nominal Threshold Voltage (V): 0.95

Stable and accurate threshold voltage specification ensures precise control and regulation of power management functions, enhancing system performance and stability.

Terminal Form: BALL

Ball terminal form offers reliable and robust connections, delivering consistent electrical performance and mechanical strength for long-term operation.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and fine-pitch connections, enabling compact board layouts and efficient signal routing for enhanced system performance.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage range accommodates various power input levels, ensuring compatibility with different power sources and system requirements.

Adjustable Threshold: YES

Ability to adjust the threshold voltage offers customization and fine-tuning options for specific application requirements, allowing for optimal performance tuning and flexibility.

Technical Specifications

Power Management ICs INA234AIYBJR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e1

Length:

1.508 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

0.95

Width (mm):

.745 mm

Trade Compliance

INA234AIYBJR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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