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BQ500412RGZT

Texas Instruments

BQ500412RGZT by Texas Instruments

BQ500412RGZT by Texas Instruments is a power management IC with a nominal voltage of 3.3V and max supply current of 60mA. It is used as a power supply support circuit in industrial applications, with a square package and terminal pitch of 0.5mm.

Median Price

$6.616

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 145 parts In-Stock

1+ parts

$5.410

100+ parts

-

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-

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145

$5.410

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-

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Arrow

USA . 549 parts In-Stock

1+ parts

$7.864

100+ parts

$7.742

1k+ parts

$6.046

10k+ parts

-

549

$7.864

$7.742

$6.046

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Verical

USA . 549 parts In-Stock

1+ parts

-

100+ parts

$7.742

1k+ parts

$6.046

10k+ parts

-

549

-

$7.742

$6.046

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Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.490

1k+ parts

$4.910

10k+ parts

$4.620

250

-

$5.490

$4.910

$4.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 154 parts In-Stock

1+ parts

$5.035

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-

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154

$5.035

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.160

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50

$5.160

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Bristol Electronics

USA . 41 parts In-Stock

1+ parts

$9.318

100+ parts

$4.349

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41

$9.318

$4.349

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Vyrian

USA . 8,404 parts In-Stock

1+ parts

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8,404

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VNN

France . 2,230 parts In-Stock

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2,230

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

1+ parts

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300

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DigiKey Marketplace

USA . 250 parts In-Stock

1+ parts

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250

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ACDS - Activité Composants Distribution Service

France . 41 parts In-Stock

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41

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Dan-Mar Components

USA . 41 parts In-Stock

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41

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 155 parts In-Stock

1+ parts

$4.500

100+ parts

-

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155

$4.500

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Corphita

USA . 3,347 parts In-Stock

1+ parts

$4.770

100+ parts

-

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3,347

$4.770

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Parana Technologies

USA . 1,456 parts In-Stock

1+ parts

$17.411

100+ parts

-

1k+ parts

$17.615

10k+ parts

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1,456

$17.411

-

$17.615

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Microchip USA

USA . 487 parts In-Stock

1+ parts

$18.350

100+ parts

$18.220

1k+ parts

$18.220

10k+ parts

$18.090

487

$18.350

$18.220

$18.220

$18.090

ChromeModa Solutions

Germany . 6,395 parts In-Stock

1+ parts

$19.563

100+ parts

$16.042

1k+ parts

-

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6,395

$19.563

$16.042

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$19.563

100+ parts

$18.585

1k+ parts

$17.607

10k+ parts

-

2,274

$19.563

$18.585

$17.607

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QUARKTWIN TECHNOLOGY LTD

USA . 24,060 parts In-Stock

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24,060

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Kepictronics

USA . 800 parts In-Stock

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800

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DigiPath Technology Company

USA . 703 parts In-Stock

1+ parts

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100+ parts

$17.638

1k+ parts

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703

-

$17.638

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GreenTree Electronics

Israel . 300 parts In-Stock

1+ parts

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300

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Overview

Discover the BQ500412RGZT by Texas Instruments, a high-quality Power Management IC that offers unmatched performance and reliability. As a leading manufacturer in the industry, Texas Instruments brings its expertise to this product, ensuring superior functionality and efficiency. Perfect for various applications, this IC provides seamless power management, making it ideal for automotive, industrial, and consumer electronics. With its innovative features and advanced technology, the BQ500412RGZT delivers exceptional value and benefits to customers, guaranteeing optimal performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, suitable for applications with limited board space.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V provides a stable and reliable power source, ensuring optimal performance of the power management IC.

Power Supplies (V): 3.3

The power supply voltage of 3.3 V further enhances compatibility with various electronic devices, making it an ideal choice for power management needs.

No. of Terminals: 48

With 48 terminals, this power management IC offers extensive connectivity options, allowing for versatile integration and configuration in complex circuitry.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and a very thin profile improves thermal dissipation and thermal management, enhancing the overall efficiency and reliability of the device.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature of 110°C ensures optimal performance even in demanding environments, increasing the product's suitability for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables reliable operation in extremely cold conditions, making it suitable for a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold offers excellent corrosion resistance and electrical conductivity, resulting in improved performance and longevity of the power management IC.

Terminal Position: QUAD

The quad terminal position allows for easy and efficient soldering, ensuring reliable connections between the power management IC and the circuit board.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this power management IC offers a low-profile design, making it suitable for applications with height restrictions.

Width (mm): 7 mm

The compact width of 7 mm increases the versatility and flexibility of the power management IC, enabling its integration into space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

The additional feature of being a power supply support circuit further enhances the functionality and value of this power management IC.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3 V ensures the power management IC can operate even with lower input voltages, enhancing its compatibility with different power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at the peak reflow temperature of 30 seconds ensures proper soldering and secure connections during assembly, improving the reliability of the power management IC.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C facilitates reliable soldering and eliminates concerns about heat damage, ensuring the longevity and performance of the power management IC.

Length: 7 mm

The compact length of 7 mm contributes to the overall small form factor of the power management IC, making it suitable for applications with limited space available.

Temperature Grade: INDUSTRIAL

The temperature grade of industrial ensures the power management IC can operate reliably in industrial environments with varying temperature ranges, making it a robust choice for industrial applications.

Maximum Supply Current (Isup): 60 mA

With a maximum supply current of 60 mA, this power management IC can handle a range of power requirements and deliver stable current to connected devices effectively.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the use of lead, making it an eco-friendly choice while still providing reliable electrical connections.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables precise and compact soldering, enhancing the overall reliability and functionality of the power management IC.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage of the power management IC to maintain optimum performance and prevent moisture-related issues.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides a safety margin and accommodates voltage fluctuations, ensuring the power management IC can operate reliably in various voltage conditions.

Technical Specifications

Power Management ICs BQ500412RGZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

BQ500412RGZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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