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BQ500511RHAR

Texas Instruments

BQ500511RHAR by Texas Instruments

BQ500511RHAR by Texas Instruments is a Power Management IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85°C, supporting power supply circuits with a voltage range of 2-3.6V. Ideal for industrial applications, it has a low profile design and nickel palladium gold finish for reliable performance.

Median Price

$2.365

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,447 parts In-Stock

1+ parts

$2.365

100+ parts

-

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4,447

$2.365

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Digiode

USA . 1,491 parts In-Stock

1+ parts

-

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1,491

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,398 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

-

2,398

$2.010

$1.960

$1.950

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Ampacity Inc.

Singapore . 2,303 parts In-Stock

1+ parts

$2.010

100+ parts

-

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2,303

$2.010

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Corohmni

South Africa . 330 parts In-Stock

1+ parts

$2.365

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330

$2.365

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Parana Technologies

USA . 1,595 parts In-Stock

1+ parts

$6.520

100+ parts

-

1k+ parts

$7.263

10k+ parts

-

1,595

$6.520

-

$7.263

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DigiPath Technology Company

USA . 2,160 parts In-Stock

1+ parts

$7.179

100+ parts

$6.605

1k+ parts

-

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2,160

$7.179

$6.605

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IDEA Electronic Components Group

UK . 681 parts In-Stock

1+ parts

$7.326

100+ parts

-

1k+ parts

$6.593

10k+ parts

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681

$7.326

-

$6.593

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ChromeModa Solutions

Germany . 533 parts In-Stock

1+ parts

$7.326

100+ parts

$6.007

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533

$7.326

$6.007

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Native Components

USA . 538 parts In-Stock

1+ parts

$16.277

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538

$16.277

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Microchip USA

USA . 179 parts In-Stock

1+ parts

$17.130

100+ parts

$17.080

1k+ parts

$17.080

10k+ parts

$17.030

179

$17.130

$17.080

$17.080

$17.030

Northwest PG Solutions

USA . 2,219 parts In-Stock

1+ parts

$17.905

100+ parts

$16.114

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2,219

$17.905

$16.114

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QUARKTWIN TECHNOLOGY LTD

USA . 16,777 parts In-Stock

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16,777

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A-Z Elektronik GmbH

Germany . 11,700 parts In-Stock

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11,700

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Metaverse IC Inc.

Canada . 9,000 parts In-Stock

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9,000

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Corphita

USA . 973 parts In-Stock

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973

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Overview

Enhance your power management solutions with the BQ500511RHAR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees high-quality products that deliver optimal performance and reliability. With its advanced features and versatile applications in Power Management ICs, this product stands out for its efficiency and durability. Experience seamless integration and superior functionality with the BQ500511RHAR, designed to meet your power supply needs with precision. Unlock the full potential of your electronic devices and systems with this cutting-edge technology. Choose Texas Instruments for unmatched value and innovation in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product a reliable choice.

Surface Mount: YES

Being surface mountable allows for easier and more efficient integration into circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape of the package provides a balanced design and facilitates placement in compact spaces.

No. of Terminals: 40

Having a higher number of terminals allows for a wider range of connections and functionality, making this product versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in demanding industrial conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish ensures excellent conductivity and corrosion resistance for long-term performance.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement allows for efficient power management and compatibility with a wide range of systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environments and operate reliably under challenging conditions.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this product is suitable for a variety of environments and can prevent damage from humidity.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage capability allows for handling a wide range of power inputs, making this product versatile and adaptable.

Technical Specifications

Power Management ICs BQ500511RHAR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

BQ500511RHAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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