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BQ50002ARHBR

Texas Instruments

BQ50002ARHBR by Texas Instruments

BQ50002ARHBR by Texas Instruments is a Power Management IC with 32 terminals, operating b/w -40 to 125 °C. It supports a supply voltage range of 4.5V to 5.5V and is ideal for automotive applications due to its compact square package design and surface-mount capability.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 24 parts In-Stock

1+ parts

$1.088

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$1.088

-

-

-

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.980

100+ parts

$1.837

1k+ parts

$1.630

10k+ parts

$1.540

3,000

$2.980

$1.837

$1.630

$1.540

Mouser Electronics

USA . 2,990 parts In-Stock

1+ parts

$2.980

100+ parts

$1.840

1k+ parts

$1.630

10k+ parts

$1.560

2,990

$2.980

$1.840

$1.630

$1.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,283 parts In-Stock

1+ parts

$1.033

100+ parts

-

1k+ parts

-

10k+ parts

-

2,283

$1.033

-

-

-

Vyrian

USA . 3,969 parts In-Stock

1+ parts

$1.088

100+ parts

-

1k+ parts

-

10k+ parts

-

3,969

$1.088

-

-

-

Cyclops Electronics Ltd

UK . 2,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,743

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 151 parts In-Stock

1+ parts

$0.547

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$0.547

-

-

-

Northwest PG Solutions

USA . 2,150 parts In-Stock

1+ parts

$0.602

100+ parts

-

1k+ parts

-

10k+ parts

-

2,150

$0.602

-

-

-

Corphita

USA . 958 parts In-Stock

1+ parts

$0.979

100+ parts

-

1k+ parts

-

10k+ parts

-

958

$0.979

-

-

-

Parana Technologies

USA . 869 parts In-Stock

1+ parts

$15.874

100+ parts

-

1k+ parts

$16.231

10k+ parts

-

869

$15.874

-

$16.231

-

DigiPath Technology Company

USA . 20 parts In-Stock

1+ parts

$17.479

100+ parts

$16.081

1k+ parts

-

10k+ parts

-

20

$17.479

$16.081

-

-

ChromeModa Solutions

Germany . 3,616 parts In-Stock

1+ parts

$17.836

100+ parts

$14.626

1k+ parts

-

10k+ parts

-

3,616

$17.836

$14.626

-

-

IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$17.836

100+ parts

$16.944

1k+ parts

$16.052

10k+ parts

-

2,182

$17.836

$16.944

$16.052

-

Corohmni

South Africa . 197 parts In-Stock

1+ parts

$19.416

100+ parts

-

1k+ parts

-

10k+ parts

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197

$19.416

-

-

-

A-Z Elektronik GmbH

Germany . 5,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,543

-

-

-

-

Alle Elektronik GmbH

Germany . 3,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,695

-

-

-

-

Kepictronics

USA . 2,743 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,743

-

-

-

-

Authorized Procurement Solutions

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,100

-

-

-

-

Lixinc

USA . 483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

483

-

-

-

-

Overview

Elevate your power management game with the BQ50002ARHBR by Texas Instruments. Designed with precision and expertise, this Power Management IC offers unrivaled quality and performance. Perfect for automotive applications, this chip carrier boasts a compact square shape, making it ideal for tight spaces. With a nominal supply voltage of 5V and a maximum operating temperature of 125°C, this IC ensures reliability and efficiency when you need it most. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Upgrade to the BQ50002ARHBR today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body of this product provides durability and protection to the internal components, making it suitable for various industrial applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems seamless.

No. of Terminals: 32

With 32 terminals, this power management IC offers a wide range of connection options for various components, enhancing flexibility in circuit design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding environments with elevated temperatures.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this power management IC is suitable for use in automotive applications, where temperature fluctuations are common.

Technical Specifications

Power Management ICs BQ50002ARHBR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ50002ARHBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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