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AM5749ABZX

Texas Instruments

AM5749ABZX by Texas Instruments

AM5749ABZX by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and Integrated Cache. It operates at up to 38.4 MHz clock frequency and is suitable for commercial applications requiring low power mode and RISC technology. The package style is Grid Array with 760 terminals in a square shape measuring 23mm x 23mm.

Median Price

$109.380

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 266 parts In-Stock

1+ parts

$68.741

100+ parts

$66.674

1k+ parts

$51.685

10k+ parts

-

266

$68.741

$66.674

$51.685

-

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$109.380

100+ parts

$89.650

1k+ parts

-

10k+ parts

-

50

$109.380

$89.650

-

-

DigiKey

USA . 44 parts In-Stock

1+ parts

$109.380

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$109.380

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,053 parts In-Stock

1+ parts

$64.087

100+ parts

-

1k+ parts

-

10k+ parts

-

2,053

$64.087

-

-

-

Vyrian

USA . 2,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 592 parts In-Stock

1+ parts

$1.715

100+ parts

-

1k+ parts

-

10k+ parts

-

592

$1.715

-

-

-

Northwest PG Solutions

USA . 989 parts In-Stock

1+ parts

$1.887

100+ parts

-

1k+ parts

-

10k+ parts

-

989

$1.887

-

-

-

Ampacity Inc.

Singapore . 25 parts In-Stock

1+ parts

$57.340

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$57.340

-

-

-

Corphita

USA . 4,274 parts In-Stock

1+ parts

$60.714

100+ parts

-

1k+ parts

-

10k+ parts

-

4,274

$60.714

-

-

-

Parana Technologies

USA . 1,983 parts In-Stock

1+ parts

$67.669

100+ parts

-

1k+ parts

-

10k+ parts

-

1,983

$67.669

-

-

-

DigiPath Technology Company

USA . 172 parts In-Stock

1+ parts

$74.512

100+ parts

$68.551

1k+ parts

-

10k+ parts

-

172

$74.512

$68.551

-

-

ChromeModa Solutions

Germany . 4,310 parts In-Stock

1+ parts

$76.033

100+ parts

$62.347

1k+ parts

-

10k+ parts

-

4,310

$76.033

$62.347

-

-

IDEA Electronic Components Group

UK . 2,220 parts In-Stock

1+ parts

$76.033

100+ parts

$72.231

1k+ parts

$68.430

10k+ parts

-

2,220

$76.033

$72.231

$68.430

-

Microchip USA

USA . 2,309 parts In-Stock

1+ parts

$121.570

100+ parts

$119.460

1k+ parts

$118.400

10k+ parts

$117.340

2,309

$121.570

$119.460

$118.400

$117.340

Overview

The Texas Instruments AM5749ABZX microprocessor is a game-changer in the industry, offering top-notch quality and reliability. With a wide range of applications in various industries, this powerful chip is designed to deliver unmatched performance and efficiency. Whether you're looking to enhance your system's speed or streamline operations, this innovative product is the perfect solution. Trust Texas Instruments to provide cutting-edge technology that meets all your needs and exceeds expectations. Unlock the full potential of your devices with the AM5749ABZX microprocessor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing memory access time and increasing overall speed.

Surface Mount: YES

The surface mount capability makes it easy to install and replace the microprocessor on circuit boards, enhancing the ease of use for manufacturers.

Maximum Supply Voltage: 1.2 V

Operating at a maximum supply voltage of 1.2 V ensures energy efficiency and helps in reducing power consumption, making it suitable for battery-powered devices.

Address Bus Width: 16

With a wider address bus width of 16, the microprocessor can handle larger memory capacities and address ranges, improving its overall performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, enabling compact design and integration in small electronic devices.

No. of Terminals: 760

Having a high number of terminals offers more connectivity options and flexibility in connecting the microprocessor to other components in the system.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable performance even in cold environments, making it suitable for various applications.

Maximum Operating Temperature: 70 °C

Operating efficiently at a maximum temperature of 70°C ensures stable performance under normal operating conditions, enhancing the reliability of the microprocessor.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish provides good conductivity, corrosion resistance, and solderability, improving the overall reliability of the connections.

Maximum Seated Height: 1.63 mm

With a low seated height of 1.63 mm, the microprocessor can be used in slim and compact electronic devices without compromising on performance or functionality.

Width: 23 mm

The width of 23 mm allows for easy integration and placement of the microprocessor on circuit boards, facilitating efficient layout design and space utilization.

Boundary Scan: YES

Having boundary scan capability allows for testing, debugging, and programming of the microprocessor, improving the quality and reliability of the overall system.

External Data Bus Width: 32

With an external data bus width of 32, the microprocessor can transfer data in larger chunks, increasing throughput and enhancing performance in data-intensive applications.

Maximum Clock Frequency: 38.4 MHz

Operating at a maximum clock frequency of 38.4 MHz ensures high-speed processing and responsiveness, making it suitable for demanding computing tasks and real-time applications.

Peak Reflow Temperature: 250 C

With a peak reflow temperature of 250°C, the microprocessor can withstand the reflow soldering process during manufacturing without any damage, ensuring reliable solder joints.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade ensures that the microprocessor can operate reliably within standard temperature ranges, making it suitable for various commercial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the microprocessor efficient and versatile for different applications.

Nominal Supply Voltage: 1.15 V

Operating at a nominal supply voltage of 1.15 V ensures stable and efficient performance, while also providing flexibility for voltage regulation and power management.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during handling and assembly, ensuring reliability in different environments.

Low Power Mode: YES

The low power mode feature enables the microprocessor to reduce power consumption during idle or low-load scenarios, enhancing energy efficiency and prolonging battery life in mobile devices.

Technical Specifications

Microprocessors AM5749ABZX attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

1.63 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5749ABZX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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