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AM5726BABCXEA

Texas Instruments

AM5726BABCXEA by Texas Instruments

AM5726BABCXEA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in industrial applications requiring low power mode and features CMOS technology for efficient performance.

Median Price

$88.416

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 984 parts In-Stock

1+ parts

$68.221

100+ parts

$66.169

1k+ parts

$51.294

10k+ parts

-

984

$68.221

$66.169

$51.294

-

DigiKey

USA . 28 parts In-Stock

1+ parts

$108.610

100+ parts

$83.563

1k+ parts

$81.509

10k+ parts

-

28

$108.610

$83.563

$81.509

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,806 parts In-Stock

1+ parts

$64.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,806

$64.810

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$72.314

100+ parts

-

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-

10k+ parts

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150

$72.314

-

-

-

VNN

France . 3,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,887

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-

-

-

Vyrian

USA . 3,280 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,280

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-

-

-

Chip Stock

USA . 304 parts In-Stock

1+ parts

-

100+ parts

-

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-

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304

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 610 parts In-Stock

1+ parts

$31.868

100+ parts

-

1k+ parts

$90.680

10k+ parts

-

610

$31.868

-

$90.680

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DigiPath Technology Company

USA . 1,209 parts In-Stock

1+ parts

$35.091

100+ parts

$32.284

1k+ parts

-

10k+ parts

-

1,209

$35.091

$32.284

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-

IDEA Electronic Components Group

UK . 1,679 parts In-Stock

1+ parts

$35.807

100+ parts

$34.017

1k+ parts

$32.226

10k+ parts

-

1,679

$35.807

$34.017

$32.226

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ChromeModa Solutions

Germany . 1,657 parts In-Stock

1+ parts

$35.807

100+ parts

$29.362

1k+ parts

-

10k+ parts

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1,657

$35.807

$29.362

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Ampacity Inc.

Singapore . 30 parts In-Stock

1+ parts

$57.990

100+ parts

-

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-

10k+ parts

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30

$57.990

-

-

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Corphita

USA . 3,628 parts In-Stock

1+ parts

$61.399

100+ parts

-

1k+ parts

-

10k+ parts

-

3,628

$61.399

-

-

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Bastille Electronics

Australia . 26 parts In-Stock

1+ parts

$72.310

100+ parts

$68.694

1k+ parts

-

10k+ parts

$64.356

26

$72.310

$68.694

-

$64.356

Lixinc

USA . 5,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,780

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Overview

Unleash the power of innovation with the AM5726BABCXEA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that redefine performance standards. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking cutting-edge technology. Experience seamless operation and enhanced capabilities with the AM5726BABCXEA, setting new benchmarks for efficiency and reliability. Join the ranks of satisfied users who have discovered the advantages of Texas Instruments microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microprocessor, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.2 V

Operating within a maximum supply voltage of 1.2V ensures efficient power consumption and reduces the potential for overheating.

Address Bus Width: 16

A wide address bus width of 16 allows for efficient communication and data transfer within the microprocessor.

Package Shape: SQUARE

Square package shape offers compatibility with standard PCB designs and facilitates easy integration into various electronic devices.

No. of Terminals: 760

With 760 terminals, this microprocessor can accommodate a wide range of connections and peripherals for enhanced functionality.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the microprocessor to perform reliably in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper ensures good conductivity and resistance to corrosion, maintaining signal integrity over time.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in various applications.

Nominal Supply Voltage: 1.15 V

Operating within a nominal supply voltage of 1.15V provides a balance between performance and power efficiency for the microprocessor.

Technical Specifications

Microprocessors AM5726BABCXEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.55 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5726BABCXEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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