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AM3715CUSD100

Texas Instruments

AM3715CUSD100 by Texas Instruments

AM3715CUSD100 by Texas Instruments is a 32-bit microprocessor with 8-bit data RAM width, 26-bit address bus width, and max clock frequency of 54 MHz. It is used in industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$42.427

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 540 parts In-Stock

1+ parts

$42.427

100+ parts

$37.713

1k+ parts

$27.730

10k+ parts

-

540

$42.427

$37.713

$27.730

-

DigiKey

USA . 90 parts In-Stock

1+ parts

$52.910

100+ parts

$38.743

1k+ parts

-

10k+ parts

-

90

$52.910

$38.743

-

-

Chip1Stop

Japan . 270 parts In-Stock

1+ parts

-

100+ parts

$33.150

1k+ parts

-

10k+ parts

-

270

-

$33.150

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,333 parts In-Stock

1+ parts

$34.618

100+ parts

-

1k+ parts

-

10k+ parts

-

1,333

$34.618

-

-

-

Vyrian

USA . 2,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,574

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 811 parts In-Stock

1+ parts

$0.522

100+ parts

-

1k+ parts

-

10k+ parts

-

811

$0.522

-

-

-

Northwest PG Solutions

USA . 2,091 parts In-Stock

1+ parts

$0.574

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

$0.574

-

-

-

Corphita

USA . 2,285 parts In-Stock

1+ parts

$32.796

100+ parts

-

1k+ parts

-

10k+ parts

-

2,285

$32.796

-

-

-

Parana Technologies

USA . 724 parts In-Stock

1+ parts

$67.397

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$67.397

-

-

-

ChromeModa Solutions

Germany . 5,797 parts In-Stock

1+ parts

$75.727

100+ parts

$62.096

1k+ parts

-

10k+ parts

-

5,797

$75.727

$62.096

-

-

IDEA Electronic Components Group

UK . 976 parts In-Stock

1+ parts

$75.727

100+ parts

$71.941

1k+ parts

$68.154

10k+ parts

-

976

$75.727

$71.941

$68.154

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Lixinc

USA . 18,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18,753

-

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

-

DigiPath Technology Company

USA . 1,324 parts In-Stock

1+ parts

-

100+ parts

$68.275

1k+ parts

-

10k+ parts

-

1,324

-

$68.275

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

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Authorized Procurement Solutions

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12

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Overview

Experience cutting-edge technology with the AM3715CUSD100 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments ensures top-quality products for a wide range of applications. From industrial automation to consumer electronics, this microprocessor offers unmatched performance, efficiency, and reliability. With integrated cache, low power mode, and a maximum clock frequency of 54 MHz, you can expect seamless operation and superior results. Trust in Texas Instruments to deliver value and excellence with the AM3715CUSD100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making this microprocessor suitable for demanding tasks.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in saving power and reducing heat dissipation, making it energy-efficient.

RAM Words: 65536

Large RAM capacity allows for multitasking and handling complex applications effectively.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enhances performance by simplifying instructions, improving speed and efficiency.

Maximum Clock Frequency: 54 MHz

High clock frequency enables fast data processing, making this microprocessor suitable for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the microprocessor.

Technical Specifications

Microprocessors AM3715CUSD100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

423

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

900 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM3715CUSD100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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