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AM1707CZKBD4

Texas Instruments

AM1707CZKBD4 by Texas Instruments

AM1707CZKBD4 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at 50 MHz. Ideal for industrial applications, it features a 13-bit address bus width and low power mode support. With a package style of grid array and terminal pitch of 1 mm, this processor offers high performance in a compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,455 parts In-Stock

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3,455

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Digiode

USA . 2,263 parts In-Stock

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2,263

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Distributors (Availability)

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Andel Nordic

Denmark . 5,953 parts In-Stock

1+ parts

$7.923

100+ parts

-

1k+ parts

$7.606

10k+ parts

$7.606

5,953

$7.923

-

$7.606

$7.606

AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$10.236

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563

$10.236

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One Stop Electronics

USA . 970 parts In-Stock

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$21.000

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970

$21.000

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Parana Technologies

USA . 1,737 parts In-Stock

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$64.606

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1,737

$64.606

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DigiPath Technology Company

USA . 908 parts In-Stock

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$71.139

100+ parts

$65.448

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908

$71.139

$65.448

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IDEA Electronic Components Group

UK . 741 parts In-Stock

1+ parts

$72.591

100+ parts

$68.961

1k+ parts

$65.332

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741

$72.591

$68.961

$65.332

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ChromeModa Solutions

Germany . 560 parts In-Stock

1+ parts

$72.591

100+ parts

$59.525

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560

$72.591

$59.525

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Component Stockers USA

USA . 785 parts In-Stock

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$99.990

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785

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,137 parts In-Stock

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16,137

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Microchip USA

USA . 5,460 parts In-Stock

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Corphita

USA . 4,456 parts In-Stock

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Northwest PG Solutions

USA . 1,518 parts In-Stock

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Native Components

USA . 702 parts In-Stock

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702

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Overview

Experience unparalleled performance and reliability with the AM1707CZKBD4 by Texas Instruments, a leading manufacturer in the industry. This microprocessor is designed to meet the highest standards, offering integrated cache and a wide range of power supplies for maximum efficiency. Ideal for industrial applications, this product boasts a high clock frequency and low power mode, ensuring optimal performance in any setting. Trust in Texas Instruments for quality you can rely on. Unlock the possibilities with the AM1707CZKBD4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, ensuring the product can withstand various environmental conditions.

Integrated Cache: YES

Integrated cache helps improve the overall performance of the microprocessor by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 1.35 V

Operates efficiently at a lower maximum supply voltage, helping in reducing power consumption and heat generation.

Address Bus Width: 13

A wider address bus allows the microprocessor to access a larger memory space, enhancing its data processing capabilities.

Package Shape: SQUARE

The square package shape makes it easier to mount the microprocessor on a circuit board, optimizing space utilization.

Bit Size: 32

A 32-bit architecture provides enhanced performance and efficiency for processing data and instructions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can reliably function in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers improved performance by simplifying instruction execution cycles and reducing processing time.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors AM1707CZKBD4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707CZKBD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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