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54F280LMQB

Texas Instruments

54F280LMQB by Texas Instruments

The Texas Instruments 54F280LMQB is a 9-bit digital arithmetic circuit with a propagation delay of 21ns. It operates in a temperature range from -55 to 125°C, making it suitable for military applications. This chip carrier package has a square shape and is surface mountable, with a supply voltage range of 4.5V to 5.5V.

Median Price

$25.131

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 1 parts In-Stock

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Vyrian

USA . 8,384 parts In-Stock

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Digiode

USA . 5,684 parts In-Stock

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Electronic Expediters

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Native Components

USA . 547 parts In-Stock

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Northwest PG Solutions

USA . 1,712 parts In-Stock

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One Stop Electronics

USA . 957 parts In-Stock

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AZTECH Wire

Italy . 855 parts In-Stock

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Parana Technologies

USA . 1,474 parts In-Stock

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DigiPath Technology Company

USA . 114 parts In-Stock

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IDEA Electronic Components Group

UK . 2,084 parts In-Stock

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ChromeModa Solutions

Germany . 2,082 parts In-Stock

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Andel Nordic

Denmark . 364 parts In-Stock

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Corphita

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments 54F280LMQB. With a reputation for high-quality products, Texas Instruments delivers top-notch reliability and performance in every component they produce. Ideal for a wide range of applications, this chip carrier is designed to provide fast and accurate calculations with a low propagation delay of just 21 ns. Whether you're designing military-grade systems or commercial electronics, the 54F280LMQB offers unmatched value and precision for all your digital arithmetic needs. Trust Texas Instruments to deliver excellence in every circuit.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and reliability, making this product suitable for harsh environments.

No. of Bits: 9

Offers high precision and accuracy in arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage, ensuring compatibility with various systems.

Propagation Delay (tpd): 21 ns

Provides fast response time, ideal for applications requiring quick calculations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and military applications.

Technical Specifications

Digital Arithmetic Circuits 54F280LMQB attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

21 ns

Maximum Seated Height:

1.905 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

54F280LMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-246-3684, 5962012463684

NIIN

012463684

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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