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54F283FMQB

Texas Instruments

54F283FMQB by Texas Instruments

54F283FMQB by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 17ns. It operates within a temperature range of -55 to 125°C and has a supply voltage range of 4.5V to 5.5V. This component, designed in MILITARY grade technology, is suitable for applications requiring fast arithmetic calculations in harsh environments.

Median Price

$14.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 139 parts In-Stock

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$14.450

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$15.173

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$14.306

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$14.450

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Vyrian

USA . 8,340 parts In-Stock

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Digiode

USA . 2,281 parts In-Stock

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Anansix

USA . 207 parts In-Stock

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Resion

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Electronic Expediters

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AZTECH Wire

Italy . 453 parts In-Stock

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$5.214

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Andel Nordic

Denmark . 185 parts In-Stock

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$7.302

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$7.010

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$7.010

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$7.302

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$7.010

$7.010

Native Components

USA . 582 parts In-Stock

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$16.437

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One Stop Electronics

USA . 201 parts In-Stock

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$17.000

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Northwest PG Solutions

USA . 1,403 parts In-Stock

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$18.081

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$16.273

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Parana Technologies

USA . 661 parts In-Stock

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$19.823

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$19.781

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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$21.828

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ChromeModa Solutions

Germany . 5,936 parts In-Stock

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$22.273

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$18.264

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IDEA Electronic Components Group

UK . 752 parts In-Stock

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$22.273

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$21.159

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$20.046

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Advanced Electronics

New Zealand . 850 parts In-Stock

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$31.222

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$30.910

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$29.661

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Corphita

USA . 3,349 parts In-Stock

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Supply Digital

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Kepictronics

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A-Plus Industry Inc.

USA . 4 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the 54F283FMQB by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unmatched reliability and performance. Ideal for a wide range of applications, this versatile component delivers value through its efficient design and advanced technology. Experience seamless operation and enhanced functionality with the 54F283FMQB, providing you with the competitive edge you need in today's fast-paced digital landscape. Choose Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and reliability, making the product suitable for harsh operating environments.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

No. of Bits: 4

Ideal for applications requiring processing of 4-bit data.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with most systems.

Maximum Operating Temperature: 125 °C

Can operate efficiently at high temperatures, suitable for various industrial applications.

Technology: TTL

Utilizes tried and tested Transistor-Transistor Logic technology for reliable performance.

Technical Specifications

Digital Arithmetic Circuits 54F283FMQB attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

17 ns

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

54F283FMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-172-1489, 5962011721489, 5962-01-221-8598, 5962012218598

NIIN

011721489, 012218598

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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