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54F283LL

Texas Instruments

54F283LL by Texas Instruments

54F283LL by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 17ns. Operating at a supply voltage range of 4.5V to 5.5V, it is ideal for military-grade applications requiring fast calculations in harsh environments. This chip carrier package features surface mount technology and a ceramic, metal-sealed cofired body for robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,676 parts In-Stock

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Anansix

USA . 1,597 parts In-Stock

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1,597

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Digiode

USA . 1,173 parts In-Stock

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AZTECH Wire

Italy . 867 parts In-Stock

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$19.504

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867

$19.504

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Parana Technologies

USA . 1,715 parts In-Stock

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$20.347

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$20.368

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$20.347

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DigiPath Technology Company

USA . 2,375 parts In-Stock

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$22.405

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$22.405

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

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$22.862

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$21.719

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$20.576

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$22.862

$21.719

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ChromeModa Solutions

Germany . 407 parts In-Stock

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$22.862

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$18.747

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407

$22.862

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One Stop Electronics

USA . 697 parts In-Stock

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$40.000

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Native Components

USA . 664 parts In-Stock

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$172.240

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$165.350

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$165.350

Northwest PG Solutions

USA . 1,135 parts In-Stock

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$189.464

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Corphita

USA . 1,296 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the high-quality 54F283LL from Texas Instruments. Designed for military-grade applications, this chip carrier package offers fast propagation delay and a wide operating temperature range. With a nominal supply voltage of 5V and 4 bits, this square-shaped chip delivers reliability and precision in your electronic projects. Trust in Texas Instruments for top-notch components that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability in harsh operating conditions, making this product suitable for industrial applications.

No. of Bits: 4

With 4 bits, this product can perform basic arithmetic operations efficiently, making it suitable for applications where limited arithmetic processing is required.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V provides compatibility with standard power supplies and makes integration easier in various systems.

Propagation Delay (tpd): 17 ns

The low propagation delay of 17 ns ensures fast processing speed, making this product ideal for applications where quick arithmetic operations are necessary.

Temperature Grade: MILITARY

Being military-grade, this product can withstand extreme temperature conditions, increasing its reliability and suitability for demanding environments.

Technology: TTL

Using TTL technology ensures compatibility with existing systems and provides reliable performance in digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits 54F283LL attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

17 ns

Maximum Seated Height:

1.905 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

54F283LL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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