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54F283DM

Texas Instruments

54F283DM by Texas Instruments

54F283DM by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 17ns. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, making it ideal for military-grade applications requiring fast calculations in compact spaces.

Median Price

$6.220

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 88 parts In-Stock

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$2.319

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$2.435

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$2.296

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$2.319

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American Microsemiconductor Inc.

USA . 5 parts In-Stock

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$10.120

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Vyrian

USA . 5,742 parts In-Stock

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Anansix

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Digiode

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A2Z Electronics, Inc.

USA . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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Parana Technologies

USA . 1,283 parts In-Stock

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$15.888

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$16.243

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DigiPath Technology Company

USA . 1,388 parts In-Stock

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$17.495

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AZTECH Wire

Italy . 429 parts In-Stock

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$17.669

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ChromeModa Solutions

Germany . 4,218 parts In-Stock

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$14.639

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IDEA Electronic Components Group

UK . 2,355 parts In-Stock

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$16.067

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Andel Nordic

Denmark . 550 parts In-Stock

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$39.841

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$38.248

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One Stop Electronics

USA . 770 parts In-Stock

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Corphita

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Supply Digital

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Native Components

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Kepictronics

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Northwest PG Solutions

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Overview

Unleash the power of digital arithmetic circuits with the Texas Instruments 54F283DM! Known for their superior quality and reliability, Texas Instruments delivers top-notch products for a variety of applications. Whether you're working on complex calculations or need precise data processing, this 4-bit arithmetic circuit offers unmatched performance and efficiency. With a durable ceramic, glass-sealed package and a wide operating temperature range, this product guarantees long-lasting functionality. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provides durability and protection for the digital arithmetic circuit, ensuring reliable performance in various environments.

No. of Bits: 4

Having 4 bits allows for handling a wide range of operations and calculations, making this digital arithmetic circuit versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easier.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this digital arithmetic circuit can withstand elevated heat levels, making it suitable for industrial and harsh environments.

Technology: TTL

Utilizing TTL technology provides fast switching speeds and low power consumption, enhancing the overall efficiency and performance of the digital arithmetic circuit.

Technical Specifications

Digital Arithmetic Circuits 54F283DM attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

17 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F283DM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-323-7462, 5962013237462

NIIN

013237462

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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