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VND830PEPTR-E

STMicroelectronics

VND830PEPTR-E by STMicroelectronics

VND830PEPTR-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact SO package (10.3mm x 7.5mm) and supports output currents up to 9A. Ideal for automotive and industrial applications requiring robust control solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

4 Star Electronics, Inc.

USA . 19,000 parts In-Stock

1+ parts

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100+ parts

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19,000

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ComSIT Distribution GmbH

Germany . 7,766 parts In-Stock

1+ parts

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7,766

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-

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ComSIT USA

USA . 7,766 parts In-Stock

1+ parts

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7,766

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Vyrian

USA . 4,022 parts In-Stock

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4,022

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Digiode

USA . 3,721 parts In-Stock

1+ parts

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3,721

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

-

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3,000

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-

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Anansix

USA . 895 parts In-Stock

1+ parts

-

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895

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$8.521

100+ parts

-

1k+ parts

$7.669

10k+ parts

-

910

$8.521

-

$7.669

-

AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$14.710

100+ parts

-

1k+ parts

-

10k+ parts

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754

$14.710

-

-

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MKK Technologies

India . 1,112 parts In-Stock

1+ parts

$16.023

100+ parts

-

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10k+ parts

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1,112

$16.023

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DigiPath Technology Company

USA . 1,112 parts In-Stock

1+ parts

$16.023

100+ parts

-

1k+ parts

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10k+ parts

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1,112

$16.023

-

-

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Ampacity Inc.

Singapore . 702 parts In-Stock

1+ parts

$32.500

100+ parts

-

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702

$32.500

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Perfect Parts

USA . 13,440 parts In-Stock

1+ parts

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13,440

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Cyclops Electronics Ltd (Excess)

UK . 6,000 parts In-Stock

1+ parts

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6,000

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Microchip USA

USA . 4,933 parts In-Stock

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4,933

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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QUARKTWIN TECHNOLOGY LTD

USA . 2,660 parts In-Stock

1+ parts

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2,660

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Kepictronics

USA . 1,843 parts In-Stock

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1,843

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Metaverse IC Inc.

Canada . 1,843 parts In-Stock

1+ parts

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1,843

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Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

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100+ parts

$10.188

1k+ parts

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1,512

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$10.188

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Corphita

USA . 1,277 parts In-Stock

1+ parts

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1,277

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Overview

Unlock unparalleled performance with the VND830PEPTR-E from STMicroelectronics—a trusted name in innovation and reliability. This advanced peripheral driver is designed to elevate your applications, offering robust built-in protections against transient, overcurrent, and thermal faults. With its compact design and dual functions, it ensures seamless integration and efficiency for automotive, industrial, and consumer electronics. Experience exceptional value and peace of mind, knowing you've chosen a solution backed by industry excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, ideal for modern electronic devices.

Maximum Supply Voltage: 36 V

A high maximum supply voltage enhances flexibility in system design, accommodating a wide range of applications.

No. of Functions: 2

Multiple functions in a single component can reduce component count and simplify circuit design.

Package Shape: RECTANGULAR

The rectangular package shape enables easy placement on PCB and compatibility with standard layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance device reliability and longevity by safeguarding against common electrical faults.

Power Supplies (V): 8/36

Flexibility in operating voltage range supports various power supply options, making it suitable for diverse applications.

No. of Terminals: 24

A higher number of terminals provides more connectivity options, facilitating complex designs and integrations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style allows for efficient heat dissipation, making it suitable for high-performance applications.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with a wide range of systems and improves power efficiency.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positions enhance layout flexibility on the PCB, simplifying design processes.

Maximum Seated Height: 2.47 mm

A low seated height allows for slimmer designs, aiding in the miniaturization of electronic devices.

Width: 7.5 mm

Compact width enables easy integration into space-constrained PCB layouts, ideal for modern electronics.

Length: 10.3 mm

The manageable length supports versatility in circuit designs while maintaining a compact footprint.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide robust mechanical stability on the PCB.

Nominal Supply Voltage: 13 V

Operating at a nominal supply voltage means optimal performance is expected at this common voltage level.

Terminal Pitch: 0.8 mm

A smaller terminal pitch allows for denser packing of components, maximizing the use of PCB real estate.

Driver No. of Bits: 2

Two bits of driver capability allow for increased control and functionality in peripheral devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable moisture sensitivity, making it suitable for most manufacturing environments.

Nominal Output Peak Current Limit: 9 A

A high current limit enables the driver to handle demanding loads, making it suitable for high-power applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed as a buffer or inverter, this driver enhances signal integrity and can interface seamlessly with various peripherals.

Output Current Flow Direction: SOURCE

The ability to source current allows for greater versatility in circuit designs where active driving is required.

Technical Specifications

Peripheral Drivers VND830PEPTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND830PEPTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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