Loading...

VND830MSP-E

STMicroelectronics

VND830MSP-E by STMicroelectronics

VND830MSP-E by STMicroelectronics is a robust peripheral driver with dual functions, supporting a max supply voltage of 36V and an output peak current limit of 9A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it operates in extreme temperatures from -40 °C to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,006

-

-

-

-

Anansix

USA . 2,148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,148

-

-

-

-

Digiode

USA . 1,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,254

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,096 parts In-Stock

1+ parts

$11.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

$11.640

-

-

-

IDEA Electronic Components Group

UK . 1,918 parts In-Stock

1+ parts

$13.490

100+ parts

-

1k+ parts

$12.141

10k+ parts

-

1,918

$13.490

-

$12.141

-

MKK Technologies

India . 537 parts In-Stock

1+ parts

$25.367

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$25.367

-

-

-

DigiPath Technology Company

USA . 537 parts In-Stock

1+ parts

$25.367

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$25.367

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,447

-

-

-

-

Microchip USA

USA . 5,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,145

-

-

-

-

Corphita

USA . 3,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,743

-

-

-

-

Parana Technologies

USA . 2,368 parts In-Stock

1+ parts

-

100+ parts

$16.129

1k+ parts

-

10k+ parts

-

2,368

-

$16.129

-

-

iodParts Technologies Inc.

India . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

448

-

-

-

-

Overview

Elevate your design with the VND830MSP-E by STMicroelectronics, a robust peripheral driver tailored for excellence. Built with advanced protection features against transient spikes, overcurrent, and thermal issues, it ensures reliability even in harsh environments. Ideal for automotive applications, this compact solution delivers superior performance and durability, making it the go-to choice for engineers seeking quality and efficiency in their projects. Unlock innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on circuit boards, facilitating compact design.

Maximum Supply Voltage: 36 V

A high maximum supply voltage broadens the range of applications, allowing it to be used in high-voltage environments.

No. of Functions: 2

Dual functionality enhances versatility, enabling it to perform multiple tasks within a single component.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle, simplifying integration into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections ensure the device operates safely under various conditions, increasing reliability.

Power Supplies (V): 13

Operating at a nominal voltage of 13 V is ideal for automotive and various industrial applications, ensuring compatibility.

No. of Terminals: 10

Ten terminals provide flexibility in circuit design and connections, making it easier to integrate with multiple components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with a heat sink reduces thermal resistance, essential for efficient heat dissipation.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage allows for operation in a wider range of applications, including low-power systems.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product is well-suited for harsh environments, especially in automotive applications.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures makes it reliable in cold environments, ensuring consistent performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and reduces the risk of oxidation, preserving the integrity of connections.

Terminal Position: DUAL

Dual terminal positioning allows for a more versatile PCB layout, improving design flexibility.

Maximum Seated Height: 3.65 mm

A low seated height allows for compact designs and can be advantageous in space-constrained applications.

Width: 7.5 mm

A moderate width ensures compatibility with standard PCB layouts while still maintaining compact dimensions.

Maximum Time At Peak Reflow Temperature (s): 30

The optimized reflow time increases manufacturing efficiency while minimizing thermal stress on the component.

Peak Reflow Temperature °C: 250

The high peak reflow temperature matches modern soldering processes, ensuring robust assembly and reliability.

Length: 9.4 mm

A concise length contributes to a compact footprint, making it easier to fit into tight spaces on circuit boards.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent qualifications for reliability and performance.

Terminal Form: GULL WING

Gull wing terminal form is favorable for soldering and ensures stable electrical connections, enhancing durability.

Nominal Supply Voltage: 13 V

This nominal supply voltage is perfect for applications requiring stable operating levels in automotive systems.

Turn-on Time: 60 us

Quick turn-on time ensures fast response in applications, which can be critical for controlling real-time systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch accommodates standard layouts, facilitating easier assembly and soldering processes.

Driver No. of Bits: 2

With a 2-bit driver, the device can handle multiple signals effectively, catering to a range of control needs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that it can withstand some moisture exposure without compromising reliability.

Nominal Output Peak Current Limit: 9 A

The high output peak current limit allows for driving substantial loads, making it ideal for more demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The versatile interface IC type fits various configurations, offering flexibility in integration with different systems.

Turn-off Time: 70 us

The fast turn-off time aids in reducing the overall latency in the control system, ensuring quick responsiveness.

Output Current Flow Direction: SOURCE

The source current flow direction allows for efficient powering of external devices, enhancing operational effectiveness.

Technical Specifications

Peripheral Drivers VND830MSP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

70 us

Turn-on Time:

60 us

Width:

7.5 mm

Trade Compliance

VND830MSP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20