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VND810PEPTR-E

STMicroelectronics

VND810PEPTR-E by STMicroelectronics

VND810PEPTR-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact low-profile design with 12 terminals. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,500

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,169

-

-

-

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Digiode

USA . 1,418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,418

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-

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Anansix

USA . 675 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$8.753

100+ parts

-

1k+ parts

$7.878

10k+ parts

-

1,669

$8.753

-

$7.878

-

Microchip USA

USA . 334 parts In-Stock

1+ parts

$9.475

100+ parts

-

1k+ parts

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10k+ parts

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334

$9.475

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-

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MKK Technologies

India . 1,642 parts In-Stock

1+ parts

$16.459

100+ parts

-

1k+ parts

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10k+ parts

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1,642

$16.459

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-

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DigiPath Technology Company

USA . 1,642 parts In-Stock

1+ parts

$16.459

100+ parts

-

1k+ parts

-

10k+ parts

-

1,642

$16.459

-

-

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AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$19.100

100+ parts

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1k+ parts

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486

$19.100

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Corphita

USA . 2,471 parts In-Stock

1+ parts

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2,471

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Parana Technologies

USA . 894 parts In-Stock

1+ parts

-

100+ parts

$10.465

1k+ parts

-

10k+ parts

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894

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$10.465

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-

Overview

Unlock the potential of your projects with the VND810PEPTR-E from STMicroelectronics, a leader in innovation and quality. This versatile peripheral driver is designed for robustness and efficiency, offering built-in protections against transient spikes, overcurrent, and thermal issues. Ideal for automotive applications and industrial automation, it ensures reliable performance, helping you achieve greater productivity and peace of mind in your designs. Discover the difference that excellence makes!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and suitable for various applications where durability is needed.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 36 V

A high maximum supply voltage broadens the product's application range, allowing it to be used in various high-voltage environments.

No. of Functions: 2

Having multiple functions increases versatility, enabling the device to handle more tasks within a single package.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and allows for easy integration into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections ensure reliability and longevity, safeguarding the device from common electrical failures.

Power Supplies (V): 8/36

Supporting a wide range of power supplies provides flexibility for designers to use it in various circuits.

No. of Terminals: 12

With 12 terminals, the product can facilitate multiple connections, making it suitable for more complex applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

This style is designed for efficient thermal management while maintaining a low profile, critical in compact designs.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage allows for compatibility with a variety of lower voltage applications, making it versatile.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB layout and can improve performance in high-density circuits.

Maximum Seated Height: 1.62 mm

A low seated height is beneficial for space-sensitive applications, allowing for compact product designs.

Width: 3.9 mm

The compact width aids in fitting the product into smaller circuit designs, optimizing overall circuit board real estate.

Length: 4.9 mm

Short length ensures efficient space usage on PCBs, making it suitable for modern miniaturized electronic devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and assembly, making the product user-friendly for manufacturers and engineers.

Nominal Supply Voltage: 13 V

The nominal supply voltage ensures effective operation in typical scenarios, guaranteeing steady performance.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for higher density in board layouts, critical for modern electronics with limited space.

Driver No. of Bits: 2

With a 2-bit driver, the product offers good control over outputs, ideal for simple directional or binary applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, helping manufacturers adhere to proper handling and reduce failure rates.

Nominal Output Peak Current Limit: 5 A

A peak current limit of 5 A supports robust performance in driving various peripherals without risk of overloading.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of driver offers flexible interfacing options, enhancing compatibility with different peripherals and systems.

Output Current Flow Direction: SOURCE

Source current capability allows the driver to effectively supply power to connected components, ensuring solid operation.

Technical Specifications

Peripheral Drivers VND810PEPTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VND810PEPTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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