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VND810

STMicroelectronics

VND810 by STMicroelectronics

VND810 by STMicroelectronics is a MOS technology peripheral driver with 16 terminals. It offers built-in protections for transient, over current, and over voltage. With a max output current of 3.5A, it is ideal for applications requiring sink output current flow direction in the range of 8-36V power supplies.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,481 parts In-Stock

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6,481

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Digiode

USA . 4,667 parts In-Stock

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4,667

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Anansix

USA . 1,467 parts In-Stock

1+ parts

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1,467

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

1+ parts

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500

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ComSIT USA

USA . 500 parts In-Stock

1+ parts

-

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 972 parts In-Stock

1+ parts

$4.844

100+ parts

-

1k+ parts

$4.359

10k+ parts

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972

$4.844

-

$4.359

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MKK Technologies

India . 1,261 parts In-Stock

1+ parts

$9.108

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1,261

$9.108

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DigiPath Technology Company

USA . 1,261 parts In-Stock

1+ parts

$9.108

100+ parts

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1,261

$9.108

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Microchip USA

USA . 256 parts In-Stock

1+ parts

$12.242

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256

$12.242

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AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$21.670

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730

$21.670

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Component Stockers USA

USA . 653 parts In-Stock

1+ parts

$99.990

100+ parts

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653

$99.990

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A-Z Elektronik GmbH

Germany . 4,886 parts In-Stock

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4,886

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Corphita

USA . 3,433 parts In-Stock

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RC Electronics

USA . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,020 parts In-Stock

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2,020

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Parana Technologies

USA . 6 parts In-Stock

1+ parts

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$5.792

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6

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$5.792

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Overview

Power up your projects with the VND810 by STMicroelectronics, a top-quality peripheral driver designed to deliver reliable performance in a compact package. With built-in protections against transient events, over current, over voltage, thermal issues, and more, this versatile driver ensures peace of mind for your applications. From automotive to industrial uses, the VND810's wide range of power supplies and high output current make it a go-to choice for demanding environments. Trust STMicroelectronics for cutting-edge technology that enhances your designs and brings value to your work. Choose the VND810 for efficient, safe, and powerful driving solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and resistance to external factors, making this peripheral driver suitable for a wide range of applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of connected devices by preventing damage from various electrical issues, enhancing the overall performance of the peripheral driver.

Technology: MOS

The MOS technology utilized in this peripheral driver allows for efficient and reliable operation, making it a suitable choice for applications requiring high performance and precision.

Nominal Output Peak Current Limit: 5 A

With a high nominal output peak current limit of 5A, this peripheral driver can effectively handle power requirements for connected devices, making it a versatile and capable choice for various applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver allows for seamless integration with different systems and devices, offering flexibility and compatibility in diverse applications.

Technical Specifications

Peripheral Drivers VND810 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SINK

Maximum Output Current:

3.5 A

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VND810 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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