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TXDV808/F2

STMicroelectronics

TXDV808/F2 by STMicroelectronics

TXDV808/F2 by STMicroelectronics is a single TRIAC with 3 terminals, capable of handling up to 8A RMS on-state current and 800V repetitive peak off-state voltage. It operates b/w -40 °C to 125°C, making it suitable for various AC switching applications in industries like home appliances and lighting systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,180 parts In-Stock

1+ parts

-

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1k+ parts

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2,180

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-

-

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Anansix

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,537

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-

-

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Digiode

USA . 995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

995

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 977 parts In-Stock

1+ parts

$3.421

100+ parts

-

1k+ parts

$3.079

10k+ parts

-

977

$3.421

-

$3.079

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MKK Technologies

India . 115 parts In-Stock

1+ parts

$6.434

100+ parts

-

1k+ parts

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10k+ parts

-

115

$6.434

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DigiPath Technology Company

USA . 115 parts In-Stock

1+ parts

$6.434

100+ parts

-

1k+ parts

-

10k+ parts

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115

$6.434

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-

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Corphita

USA . 3,868 parts In-Stock

1+ parts

-

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3,868

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Parana Technologies

USA . 1,772 parts In-Stock

1+ parts

-

100+ parts

$4.091

1k+ parts

-

10k+ parts

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1,772

-

$4.091

-

-

Overview

Discover the TXDV808/F2 by STMicroelectronics, a high-quality TRIAC perfect for a wide range of applications. With STMicroelectronics' reputation for excellence in manufacturing, this TRIAC offers unparalleled reliability and performance. From controlling lighting to regulating motor speed, this versatile component provides value and benefits to customers seeking efficient and dependable solutions. Upgrade your projects with the TXDV808/F2 and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting.

Maximum DC Gate Trigger Current: 100 mA

Allows for efficient and reliable triggering of the device.

Configuration: SINGLE

Simplifies installation and operation of the product.

Surface Mount: YES

Enables easy and space-saving mounting on circuit boards.

Package Shape: RECTANGULAR

Facilitates easy integration into electronic systems.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Ensures minimal leakage current when the device is in the off-state.

No. of Terminals: 3

Simplifies connection and installation of the product.

Maximum Operating Temperature: 125 °C

Allows the product to operate efficiently in high-temperature environments.

Trigger Device Type: ALTERNISTOR TRIAC

Provides reliable triggering mechanism for the product.

Maximum RMS On-state Current: 8 A

Allows for the handling of high current loads.

Case Connection: ISOLATED

Ensures safety and protection from electric shocks.

Repetitive Peak Off-state Voltage: 800 V

Can withstand high voltage levels for extended periods.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Protects the device from voltage spikes and surges.

Maximum Holding Current: 100 mA

Ensures the device remains in the on-state even in the absence of a triggering signal.

Technical Specifications

Triode For Alternating Current (TRIAC) TXDV808/F2 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

100 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

100 mA

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

800 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

TXDV808/F2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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