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TXDV412/F5

STMicroelectronics

TXDV412/F5 by STMicroelectronics

TXDV412/F5 by STMicroelectronics is a TRIAC with 3 terminals, max. RMS on-state current of 12A, and max. DC gate trigger voltage of 1.5V. It is used as an alternistor TRIAC in applications requiring isolated case connection and operating temperatures ranging from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,799 parts In-Stock

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2,799

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Digiode

USA . 664 parts In-Stock

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664

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Anansix

USA . 252 parts In-Stock

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252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,311 parts In-Stock

1+ parts

$4.121

100+ parts

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1k+ parts

$3.709

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2,311

$4.121

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$3.709

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MKK Technologies

India . 1,191 parts In-Stock

1+ parts

$7.749

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1,191

$7.749

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DigiPath Technology Company

USA . 1,191 parts In-Stock

1+ parts

$7.749

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1,191

$7.749

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Parana Technologies

USA . 830 parts In-Stock

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$4.927

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830

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$4.927

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Corphita

USA . 797 parts In-Stock

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797

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Overview

STMicroelectronics presents the TXDV412/F5, a top-tier Triode For Alternating Current (TRIAC) that boasts unparalleled quality and reliability. With its innovative design and durable construction using PLASTIC/EPOXY materials, this product is a game-changer in the industry. Perfect for a wide range of applications, this TRIAC offers customers exceptional value with its high performance, low leakage current, and efficient operation. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations. Experience the difference with the TXDV412/F5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to physical damage, making the product reliable for long-term use.

Maximum DC Gate Trigger Current: 100 mA

Allows for precise control and triggering of the TRIAC, ensuring accurate performance.

Configuration: SINGLE

Simplified design with single configuration makes installation and setup easier and more efficient.

Package Shape: RECTANGULAR

Compact rectangular shape saves space and allows for easy integration into various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong connections and stability, reducing the risk of loose connections.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low leakage current ensures energy efficiency and prevents unnecessary power loss.

No. of Terminals: 3

Simplified three-terminal design enables easy connection and integration with other components.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure installation and mounting in a variety of setups and environments.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in different temperature conditions.

Trigger Device Type: ALTERNISTOR TRIAC

The Alternistor TRIAC type offers improved performance and efficiency compared to traditional TRIACs.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in various environments and climates.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making setup quick and easy.

Maximum RMS On-state Current: 12 A

High on-state current rating allows for reliable and efficient power handling in different applications.

Maximum DC Gate Trigger Voltage: 1.5 V

Low trigger voltage enables efficient control and triggering of the TRIAC with minimal power input.

Case Connection: ISOLATED

Isolated case connection provides safety and protection against electrical hazards, ensuring user and equipment safety.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating allows for handling of high-voltage applications with ease and efficiency.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Fast rate of rise of off-state voltage ensures quick response and performance in high-frequency applications.

Maximum Holding Current: 100 mA

High holding current ensures stable operation and prevents unintentional turn-off, improving overall reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) TXDV412/F5 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

100 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

100 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

TXDV412/F5 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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