Loading...

TXDV408/F2

STMicroelectronics

TXDV408/F2 by STMicroelectronics

STMicroelectronics' TXDV408/F2 is a single TRIAC with 400V repetitive peak off-state voltage and 8A max RMS on-state current. It has a plastic/epoxy package, Gull Wing terminals, and operates b/w -40 to 125 °C. Ideal for AC power control applications requiring high reliability and isolation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Digiode

USA . 2,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,247

-

-

-

-

Anansix

USA . 649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

649

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 535 parts In-Stock

1+ parts

$3.153

100+ parts

-

1k+ parts

$2.838

10k+ parts

-

535

$3.153

-

$2.838

-

MKK Technologies

India . 2,287 parts In-Stock

1+ parts

$5.929

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

$5.929

-

-

-

DigiPath Technology Company

USA . 2,287 parts In-Stock

1+ parts

$5.929

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

$5.929

-

-

-

Corphita

USA . 2,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,613

-

-

-

-

Parana Technologies

USA . 2,152 parts In-Stock

1+ parts

-

100+ parts

$3.770

1k+ parts

-

10k+ parts

-

2,152

-

$3.770

-

-

Overview

Unlock the power of precision and reliability with the TXDV408/F2 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers exceptional quality and performance in their Triode For Alternating Current (TRIAC) products. Whether you're looking for superior efficiency in lighting control, motor speed regulation, or heating applications, this product is designed to exceed your expectations. With its advanced features and durable construction, the TXDV408/F2 provides unmatched value and benefits to customers seeking a top-of-the-line solution for their electronic needs. Elevate your projects with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Maximum DC Gate Trigger Current: 100 mA

With a high DC gate trigger current, this product can efficiently control the switching of AC power circuits.

Configuration: SINGLE

Single configuration simplifies the design and installation process, making it easy to integrate into existing systems.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, allowing for efficient placement in tight spaces.

Terminal Form: GULL WING

Gull wing terminals offer strong mechanical support and secure solder connections, ensuring reliable operation.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low off-state leakage current helps reduce power consumption and ensures minimal standby power loss.

No. of Terminals: 3

Having 3 terminals allows for easy connection and control of the TRIAC device in circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides stability and ease of installation, making it suitable for industrial applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the TRIAC can withstand challenging environmental conditions without performance degradation.

Trigger Device Type: ALTERNISTOR TRIAC

Alternistor TRIAC type offers improved commutation performance and reliability compared to standard TRIACs.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without issues.

Terminal Position: SINGLE

Single terminal position simplifies wiring and installation, reducing the risk of errors and improving reliability.

Maximum RMS On-state Current: 8 A

High maximum RMS on-state current rating enables the TRIAC to handle significant loads with ease.

Maximum DC Gate Trigger Voltage: 1.5 V

Low gate trigger voltage facilitates efficient control of the TRIAC, enhancing overall performance.

Case Connection: ISOLATED

Isolated case connection provides safety and protection against electrical shocks, making the product suitable for high-voltage applications.

Repetitive Peak Off-state Voltage: 400 V

High repetitive peak off-state voltage rating ensures reliable performance in voltage regulation and control applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

High minimum critical rate of rise of off-state voltage allows for quick and efficient switching, reducing heat dissipation and improving efficiency.

Maximum Holding Current: 100 mA

Having a high maximum holding current ensures the TRIAC remains in the on-state even after the gate signal is removed, providing reliable operation.

Technical Specifications

Triode For Alternating Current (TRIAC) TXDV408/F2 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

100 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

100 mA

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

TXDV408/F2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19